To test, evaluate and characterize new integrated circuits (ICs) for high temperature application no easy, cheap or portable platform is available. On the other hand, industrial applications require more and more high temperature circuits.

To solve all these problems, a novel and modular platform was developed by IMMS, which allows for heating ICs up to 300 °C. The main feature is the portable high temperature fixture with integrated heating capability combined with a reliable method to contact the device. This way the device can be operated and heated at the same time.

The platform was applied to a high temperature sensor interface which conditions signals from Wheatstone pressure sensors. Due to the modularity, the presented platform can be adapted to characterization as well as demonstration scenarios. By observing the circuit during heating and cooling processes, the performance can be recorded in real time by the integrated single board computer.

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