Advanced Materials and Interconnect Technologies for Next Generation Smart Devices

Rozalia Beica;

Rozalia Beica

–Dow Chemicals

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Eric Huenger

–Dow Chemicals

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Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–26.

https://doi.org/10.4071/2017DPC-GBC_Presentation3

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Advanced Materials and Interconnect Technologies for Next Generation Smart Devices

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Advanced Materials and Interconnect Technologies for Next Generation Smart Devices