Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Tyler, Daniel; Lukich, Svetlana; DePersia, Raul; Guilbeau, Chase; Carter, Mark

doi:10.4071/2380-4491.2021.HiTEC.000031

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000031–000040.

https://doi.org/10.4071/2380-4491.2021.HiTEC.000031

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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

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