The growth of the wireless world, especially the increasing popularity of the Internet of Things, has created a need for cost-effective and environmentally friendly electronics. Great potential lies especially in versatile applications of passive UHF RFID components. However, the reliability of these components is a major issue to be addressed. This paper presents a preliminary reliability study of glue-coated and non-coated brush-painted copper tags on a plywood substrate in high humidity conditions. The passive UHF RFID components presented in this paper are fabricated using brush-painting and photonic sintering of cost-effective copper oxide ink directly on a plywood substrate. The performance of the glue-coated and non-coated tags is evaluated through wireless tag measurements before and after high humidity testing. The measurement results show that the copper tags on plywood substrate initially achieve peak read ranges of 7–8 meters and the applied coating does not affect to the read range. Moisture does not prevent the coated tags from working in a tolerable way, although the tag performance slightly temporarily decreases due to the moisture absorption. However, when the moisture exposure is long, the performance degradation comes irreversible. The absorbed moisture decreases the read range of the non-coated tags and the performance does not return back to normal after drying. Hence, the coating improves the reliability of the tags in a moist environment compared to the non-coated tags. Based on our results, the plywood material and the used manufacturing methods are very potential for low-cost, high-volume green electronics manufacturing.
Skip Nav Destination
Article navigation
Research Article|
July 01 2016
Reliability of Passive UHF RFID Copper Tags on Plywood Substrate in High Humidity Conditions
Erja Sipilä;
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
Phone +358 40 8490103 and E-mail erja.sipila@tut.fi
Search for other works by this author on:
Johanna Virkki;
Johanna Virkki
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
Search for other works by this author on:
Lauri Sydänheimo;
Lauri Sydänheimo
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
Search for other works by this author on:
Leena Ukkonen
Leena Ukkonen
Department of Electronics and Communications Engineering, Tampere University of Technology, P.O.Box 692, FI-33101 Tampere, Finland
Search for other works by this author on:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (NOR): 12–16.
Citation
Erja Sipilä, Johanna Virkki, Lauri Sydänheimo, Leena Ukkonen; Reliability of Passive UHF RFID Copper Tags on Plywood Substrate in High Humidity Conditions. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 1 July 2016; 2016 (NOR): 12–16. doi: https://doi.org/10.4071/2016-NOR-Sipila
Download citation file:

Citing articles via
Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez, A.M. Francis, J. Holmes, T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter