Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CIS, MEMS, sensors, and RF filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around 2.1 million wafers in 2021, expanding at an 18% CAGR. The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.

CIS still commanded more than 80% share of TSV market wafer volume in 2015, although this will decrease to around 56% by 2021. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors. However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 38% of CIS production by 2021. The presentation will explain the market's dynamics and give an overview of all segments and key markets of the TSV based 3D/2.5D IC packaging.

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