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Research Article|
January 01 2017
Market Drivers and Packaging Trends for Automotive Electronics
E. Jan Vardaman
E. Jan Vardaman
President and Founder
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Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–26.
Citation
E. Jan Vardaman; Market Drivers and Packaging Trends for Automotive Electronics. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 1 January 2017; 2017 (DPC): 1–26. doi: https://doi.org/10.4071/2017DPC-GBC_Presentation1
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