New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) provide interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs.

As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, bonded stacks leveraging TGV and in carrier applications. Glass forming processes allow the potential to both form in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods and address packaging challenges in a cost effective way.

We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability, describe areas where glass is being leveraged to achieve goals of next generation products and how properties of different glass types are leveraged by application.

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