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Research Article|
January 01 2017
Advanced Materials and Interconnect Technologies for Next Generation Smart Devices
Eric Huenger
Eric Huenger
–Dow Chemicals
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Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–26.
Citation
Rozalia Beica, Eric Huenger; Advanced Materials and Interconnect Technologies for Next Generation Smart Devices. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 1 January 2017; 2017 (DPC): 1–26. doi: https://doi.org/10.4071/2017DPC-GBC_Presentation3
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