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January 01 2017
Heterogeneous Integration “packaging the Future”
Ron Huemoeller
Ron Huemoeller
Corporate V.P., WWRD & Technology Strategy
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Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–53.
Citation
Ron Huemoeller; Heterogeneous Integration “packaging the Future”. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 1 January 2017; 2017 (DPC): 1–53. doi: https://doi.org/10.4071/2017DPC-Keynote1_Huemoeller
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