RelChip has performed life test studies on its RAM and has shown that Silicon On Insulator (SOI) processing with Aluminum-Tungsten metal traces can operate for over 4000 hours at 350°C and do not fail due to electromigration. Three parts were randomly selected and functionally tested at the extreme temperature using accelerated testing (HAST). The parts were pulled periodically for in-depth testing and examination. Test results indicate failures are due to device failures, and not electromigration.

This content is only available as a PDF.