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Research Article|
June 22 2021
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler;
Svetlana Lukich;
Raul DePersia;
Chase Guilbeau;
Mark Carter
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000031–000040.
Citation
Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter; Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 1 April 2021; 2021 (HiTEC): 000031–000040. doi: https://doi.org/10.4071/2380-4491.2021.HiTEC.000031
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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter