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Journal of Microelectronics and Electronic Packaging
International Symposium on Microelectronics
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Advancing Microelectronics
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Journal of Microelectronics and Electronic Packaging
International Symposium on Microelectronics
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Advancing Microelectronics
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Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
(2018) 2018 (HiTEC): 000007–000014.
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