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Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000028–000031.
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Materials Science Forum (2019) 963: 864.