Skip to Main Content
Skip Nav Destination

Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000028–000031.
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Shinji Sato
  • Fumiki Kato
  • Hidekazu Tanisawa
  • Kenichi Koui
  • Kinuyo Watanabe
  • Yoshinori Murakami
  • Yusuke Kobayashi
  • Hiroshi Sato
  • Hiroshi Yamaguchi
  • Shinsuke Harada
Materials Science Forum (2019) 963: 864.
Close Modal

or Create an Account

Close Modal
Close Modal