Skip Nav Destination
Highly Reliable Pressure-Less Silver Sintering Joints
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000045–000050.
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- Sihai Chen
- Evan Wernicki
- Sara Wright
- Christine LaBarbera
- Ning-Cheng Lee
International Symposium on Microelectronics (2019) 2019 (1): 000535.