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Highly Reliable Pressure-Less Silver Sintering Joints

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000045–000050.
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Sihai Chen
  • Evan Wernicki
  • Sara Wright
  • Christine LaBarbera
  • Ning-Cheng Lee
International Symposium on Microelectronics (2019) 2019 (1): 000535.
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