Skip to Main Content
Skip Nav Destination

Novel solder-mesh interconnection design for power module applications

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000057–000062.
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Adrian Lis
  • Hiroaki Tatsumi
  • Tomoki Matsuda
  • Tomokazu Sano
  • Yoshihiro Kashiba
  • Akio Hirose
Journal of Electronic Materials (2019) 48 (6): 3699.
Close Modal

or Create an Account

Close Modal
Close Modal