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Journal of Microelectronics and Electronic Packaging
International Symposium on Microelectronics
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Advancing Microelectronics
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Journal of Microelectronics and Electronic Packaging
International Symposium on Microelectronics
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Advancing Microelectronics
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Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
(2018) 2018 (HiTEC): 000032–000038.
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
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