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Inkjet Printing Technology: A Novel Bottom-up Approach For Multilayer Ceramic Components and High Definition Printed Electronic Devices
C. DOSSOU-YOVO; M. MOUGENOT; E. BEAUDROUET; M. BESSAUDOU; N. BERNARDIN; F. CHARIFI; C. COQUET; M. BORELLA; R. NOGUERA; C. MODES; M. LEJEUNE; P. LAURIER; D. DETEMMERMAN; P. ESCURE; H. LAVILLE; N. DELHOTES; S. VERDEYMES
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez<span class='al-author-delim'>, </span>A.M. Francis<span class='al-author-delim'>, </span>J. Holmes<span class='al-author-delim'>, </span>T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig<span class='al-author-delim'>, </span>Sebastian Holtkämper<span class='al-author-delim'>, </span>Lars Helmich<span class='al-author-delim'>, </span>Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert<span class='al-author-delim'>, </span>Sebastian Braun<span class='al-author-delim'>, </span>Norbert Kordas<span class='al-author-delim'>, </span>Andre Kosfeld<span class='al-author-delim'>, </span>Alexander Utz<span class='al-author-delim'>, </span>Constanze Weber<span class='al-author-delim'>, </span>Olaf Rämer<span class='al-author-delim'>, </span>Malte Spanier<span class='al-author-delim'>, </span>Martin Ihle<span class='al-author-delim'>, </span>Steffen Ziesche<span class='al-author-delim'>, </span>Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler<span class='al-author-delim'>, </span>Svetlana Lukich<span class='al-author-delim'>, </span>Raul DePersia<span class='al-author-delim'>, </span>Chase Guilbeau<span class='al-author-delim'>, </span>Mark Carter
