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Volume 2013, Issue HITEN
1 January 2013
Issue Cover
ISSN 2380-4491
230C Hermetically Sealed SMD Tantalum Capacitors
T. Zednicek; M. Biler; J. Petrzilek; I. Pinwill; R. Faltus
View Articletitled, 230C Hermetically Sealed SMD Tantalum Capacitors
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Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications
Catherine Bunel; Laurent Lengignon
View Articletitled, Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications
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KEMET SMD Film Capacitors for High Temperature Applications
Luca Caliari; Paola Bettacchi; Evangelista Boni; Davide Montanari; Arrigo Gamberini; Luigi Barbieri; Francesco Bergamaschi
View Articletitled, KEMET SMD Film Capacitors for High Temperature Applications
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Advanced Ceramic Capacitor Solutions for High Temperature Applications
Abhijit Gurav; Xilin Xu; Jim Magee; Paul Staubli; John Bultitude; Travis Ashburn
View Articletitled, Advanced Ceramic Capacitor Solutions for High Temperature Applications
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Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh Environments
Mustafa A. Syammach; Mustapha Habibi; Fauzi A. Syammach
View Articletitled, Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh Environments
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Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors
James Galipeau; Matt Gerlach
View Articletitled, Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors
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Advanced Applications of High Temperature Magnetics
John R. Fraley; Edgar Cilio; Bryon Western
View Articletitled, Advanced Applications of High Temperature Magnetics
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A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications
Z. Cole; B. S. Passmore; B. Whitaker; A. Barkley; T. McNutt; A. B. Lostetter
View Articletitled, A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications
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The Thermal Integrity of Integrated GaN Power Modules
J. Roberts; T. MacElwee; L. Yushyna
View Articletitled, The Thermal Integrity of Integrated GaN Power Modules
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High temperature, Smart Power Module for aircraft actuators
Khalil El Falahi; Stanislas Hascoët; Cyril Buttay; Pascal Bevilacqua; Luong-Viet Phung; Dominique Tournier; Bruno Allard; Dominique Planson
View Articletitled, High temperature, Smart Power Module for aircraft actuators
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POL and LDO for Harsh Environment Applications
Ramesh Khanna; Srinivasan Venkataraman
View Articletitled, POL and LDO for Harsh Environment Applications
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High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices
Christina DiMarino; Zheng Chen; Dushan Boroyevich; Rolando Burgos; Paolo Mattavelli
View Articletitled, High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices
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High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices
Brian Wilkinson; Kent Walters; Paul Ellerman
View Articletitled, High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices
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Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage Applications
Yoann Dusé; Fabien Laplace; Nicolas Joubert; Xavier Montmayeur; Noureddine Zitouni; Sebastien Vieusses; Gregory Thepaut; Arnaud Anota; Gonzalo Picun
View Articletitled, Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage Applications
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High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability Testing
Joe G. Guimont; Bruce W. Ohme
View Articletitled, High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability Testing
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High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology
K. Grella; S. Dreiner; H. Vogt; U. Paschen
View Articletitled, High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology
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Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing
Alexander Schmidt; Holger Kappert; Rainer Kokozinski
View Articletitled, Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing
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A 250°C ASIC Technology
Lynn Reed
View Articletitled, A 250°C ASIC Technology
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Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature Environments
Michael Arkin; Jeff Watson; Michael Siu; Michael Cusack
View Articletitled, Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature Environments
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Multi-bit memory cell using long-range non-anchored actuation for high temperature applications
Mehrdad Elyasi; Chengkuo Lee; Cheng-Yu Hsieh; Dim-Lee Kwong
View Articletitled, Multi-bit memory cell using long-range non-anchored actuation for high temperature applications
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A High Temperature, Frequency Output Silicon Temperature Sensor
Shane Rose; Mark Hahn
View Articletitled, A High Temperature, Frequency Output Silicon Temperature Sensor
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Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)
D MacGugan
View Articletitled, Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)
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Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel
Rito Mijarez; David Pascacio; Ricardo Guevara; Olimpia Pacheco; Carlos Tello; Joaquín Rodríguez
View Articletitled, Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel
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Packaging technologies for high temperature control electronics
Conor Slater; Radisav Cojbasic; Thomas Maeder; Yusuf Leblebici; Peter Ryser
View Articletitled, Packaging technologies for high temperature control electronics
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The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures
S. Habenicht; H.J. Funke; D. Gruber; D. Oelgeschläger; O. Schumacher; R. Gehn; S. Walczyk; A. Mavinkurve; Th. Reiners; R. Fiederling; M. Vogl; J. Schug; H. Willwohl; J. Blandin; M. Hutter; C. Ehrhardt; H. Oppermann
View Articletitled, The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures
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Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment
Riko I Made; Eric Jian Rong Phua; Key Wen Tan; Wei Chuan Ong; Clare Guanqi Huang; Hock Guan Ong; Vivek Chidambaram Nachiappan; Chee Cheong Wong; Chen Zhong; Chee Lip Gan
View Articletitled, Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment
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DIP Test Socket Characterization for 300°C
David Shaddock; Liang Yin; Zhenzhen Shen; Zhangming Zhou; R. Wayne Johnson
View Articletitled, DIP Test Socket Characterization for 300°C
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Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
M. Mirgkizoudi; C. Liu; P. Conway; S. Riches
View Articletitled, Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
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Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
S T Riches; C Johnston; A Lui
View Articletitled, Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
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Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold Surfaces
G. Lewis; G. Dumas; S. H. Mannan
View Articletitled, Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold Surfaces
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LT-TLPS Die Attach for High Temperature Electronic Packaging
Hannes Greve; F. Patrick McCluskey
View Articletitled, LT-TLPS Die Attach for High Temperature Electronic Packaging
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Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature
Fumiki Kato; Fengqun Lang; Simanjorang Rejeki; Hiroshi Nakagawa; Hiroshi Yamaguchi; Hiroshi Sato
View Articletitled, Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature
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Lead-free Solder Attach for 200°C Applications
Zhenzhen Shen; Kun Fang; Mike Hamilton; R. Wayne Johnson; Erica Snipes; Michael Bozack
View Articletitled, Lead-free Solder Attach for 200°C Applications
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Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
Eric Jian Rong Phua; Ming Liu; Riko I Made; Liying Zhang; Chee Cheong Wong; Zhong Chen; Min Woo Rhee; Xiao Hu; Chee Lip Gan
View Articletitled, Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
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Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High Temperatures
R. J. Kaplar; D. R. Hughart; S. Atcitty; J. D. Flicker; S. DasGupta; M. J. Marinella
View Articletitled, Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High Temperatures
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A 4H-SiC Bipolar Technology for High-temperature Integrated Circuits
L. Lanni; B. G. Malm; C.-M. Zetterling; M. Östling
View Articletitled, A 4H-SiC Bipolar Technology for High-temperature Integrated Circuits
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Experimental Investigation of Electro-thermal Stress Impact on SiC-BJTs Electrical Characteristics
Thibaut Chailloux; Cyril Calvez; Pascal Bevilacqua; Dominique Planson; Dominique Tournier
View Articletitled, Experimental Investigation of Electro-thermal Stress Impact on SiC-BJTs Electrical Characteristics
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1200 V SiC Schottky Rectifiers optimized for ≥ 250 °C operation with low junction capacitance
Ranbir Singh; Siddarth Sundaresan
View Articletitled, 1200 V SiC Schottky Rectifiers optimized for ≥ 250 °C operation with low junction capacitance
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Reliability of SiC Digital Telemetry Circuits on AlN Substrate
Reza Ghandi; Cheng-Po Chen; Liang Yin; Rich Saia; Tammy Johnson; Peter Sandvik; Kun Fang; R. Wayne Johnson
View Articletitled, Reliability of SiC Digital Telemetry Circuits on AlN Substrate
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  • ISSN 2380-4491
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