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The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures
S. Habenicht; H.J. Funke; D. Gruber; D. Oelgeschläger; O. Schumacher; R. Gehn; S. Walczyk; A. Mavinkurve; Th. Reiners; R. Fiederling; M. Vogl; J. Schug; H. Willwohl; J. Blandin; M. Hutter; C. Ehrhardt; H. Oppermann
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez<span class='al-author-delim'>, </span>A.M. Francis<span class='al-author-delim'>, </span>J. Holmes<span class='al-author-delim'>, </span>T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig<span class='al-author-delim'>, </span>Sebastian Holtkämper<span class='al-author-delim'>, </span>Lars Helmich<span class='al-author-delim'>, </span>Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert<span class='al-author-delim'>, </span>Sebastian Braun<span class='al-author-delim'>, </span>Norbert Kordas<span class='al-author-delim'>, </span>Andre Kosfeld<span class='al-author-delim'>, </span>Alexander Utz<span class='al-author-delim'>, </span>Constanze Weber<span class='al-author-delim'>, </span>Olaf Rämer<span class='al-author-delim'>, </span>Malte Spanier<span class='al-author-delim'>, </span>Martin Ihle<span class='al-author-delim'>, </span>Steffen Ziesche<span class='al-author-delim'>, </span>Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler<span class='al-author-delim'>, </span>Svetlana Lukich<span class='al-author-delim'>, </span>Raul DePersia<span class='al-author-delim'>, </span>Chase Guilbeau<span class='al-author-delim'>, </span>Mark Carter