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Volume 2013, Issue HITEN

1 January 2013

ISSN 2380-4491

230C Hermetically Sealed SMD Tantalum Capacitors

T. Zednicek; M. Biler; J. Petrzilek; I. Pinwill; R. Faltus

Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications

Catherine Bunel; Laurent Lengignon

KEMET SMD Film Capacitors for High Temperature Applications

Luca Caliari; Paola Bettacchi; Evangelista Boni; Davide Montanari; Arrigo Gamberini; Luigi Barbieri; Francesco Bergamaschi

Advanced Ceramic Capacitor Solutions for High Temperature Applications

Abhijit Gurav; Xilin Xu; Jim Magee; Paul Staubli; John Bultitude; Travis Ashburn

Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh Environments

Mustafa A. Syammach; Mustapha Habibi; Fauzi A. Syammach

Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors

James Galipeau; Matt Gerlach

Advanced Applications of High Temperature Magnetics

John R. Fraley; Edgar Cilio; Bryon Western

A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications

Z. Cole; B. S. Passmore; B. Whitaker; A. Barkley; T. McNutt; A. B. Lostetter

The Thermal Integrity of Integrated GaN Power Modules

J. Roberts; T. MacElwee; L. Yushyna

High temperature, Smart Power Module for aircraft actuators

Khalil El Falahi; Stanislas Hascoët; Cyril Buttay; Pascal Bevilacqua; Luong-Viet Phung; Dominique Tournier; Bruno Allard; Dominique Planson

POL and LDO for Harsh Environment Applications

Ramesh Khanna; Srinivasan Venkataraman

High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices

Christina DiMarino; Zheng Chen; Dushan Boroyevich; Rolando Burgos; Paolo Mattavelli

High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices

Brian Wilkinson; Kent Walters; Paul Ellerman

Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage Applications

Yoann Dusé; Fabien Laplace; Nicolas Joubert; Xavier Montmayeur; Noureddine Zitouni; Sebastien Vieusses; Gregory Thepaut; Arnaud Anota; Gonzalo Picun

High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability Testing

Joe G. Guimont; Bruce W. Ohme

High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology

K. Grella; S. Dreiner; H. Vogt; U. Paschen

Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing

Alexander Schmidt; Holger Kappert; Rainer Kokozinski

A 250°C ASIC Technology

Lynn Reed

Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature Environments

Michael Arkin; Jeff Watson; Michael Siu; Michael Cusack

Multi-bit memory cell using long-range non-anchored actuation for high temperature applications

Mehrdad Elyasi; Chengkuo Lee; Cheng-Yu Hsieh; Dim-Lee Kwong

A High Temperature, Frequency Output Silicon Temperature Sensor

Shane Rose; Mark Hahn

Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)

D MacGugan

Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel

Rito Mijarez; David Pascacio; Ricardo Guevara; Olimpia Pacheco; Carlos Tello; Joaquín Rodríguez

Packaging technologies for high temperature control electronics

Conor Slater; Radisav Cojbasic; Thomas Maeder; Yusuf Leblebici; Peter Ryser

The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures

S. Habenicht; H.J. Funke; D. Gruber; D. Oelgeschläger; O. Schumacher; R. Gehn; S. Walczyk; A. Mavinkurve; Th. Reiners; R. Fiederling; M. Vogl; J. Schug; H. Willwohl; J. Blandin; M. Hutter; C. Ehrhardt; H. Oppermann

Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment

Riko I Made; Eric Jian Rong Phua; Key Wen Tan; Wei Chuan Ong; Clare Guanqi Huang; Hock Guan Ong; Vivek Chidambaram Nachiappan; Chee Cheong Wong; Chen Zhong; Chee Lip Gan

DIP Test Socket Characterization for 300°C

David Shaddock; Liang Yin; Zhenzhen Shen; Zhangming Zhou; R. Wayne Johnson

Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments

M. Mirgkizoudi; C. Liu; P. Conway; S. Riches

Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections

S T Riches; C Johnston; A Lui

Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold Surfaces

G. Lewis; G. Dumas; S. H. Mannan

LT-TLPS Die Attach for High Temperature Electronic Packaging

Hannes Greve; F. Patrick McCluskey

Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature

Fumiki Kato; Fengqun Lang; Simanjorang Rejeki; Hiroshi Nakagawa; Hiroshi Yamaguchi; Hiroshi Sato

Lead-free Solder Attach for 200°C Applications

Zhenzhen Shen; Kun Fang; Mike Hamilton; R. Wayne Johnson; Erica Snipes; Michael Bozack

Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications

Eric Jian Rong Phua; Ming Liu; Riko I Made; Liying Zhang; Chee Cheong Wong; Zhong Chen; Min Woo Rhee; Xiao Hu; Chee Lip Gan

Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High Temperatures

R. J. Kaplar; D. R. Hughart; S. Atcitty; J. D. Flicker; S. DasGupta; M. J. Marinella

A 4H-SiC Bipolar Technology for High-temperature Integrated Circuits

L. Lanni; B. G. Malm; C.-M. Zetterling; M. Östling

Experimental Investigation of Electro-thermal Stress Impact on SiC-BJTs Electrical Characteristics

Thibaut Chailloux; Cyril Calvez; Pascal Bevilacqua; Dominique Planson; Dominique Tournier

1200 V SiC Schottky Rectifiers optimized for ≥ 250 °C operation with low junction capacitance

Ranbir Singh; Siddarth Sundaresan

Reliability of SiC Digital Telemetry Circuits on AlN Substrate

Reza Ghandi; Cheng-Po Chen; Liang Yin; Rich Saia; Tammy Johnson; Peter Sandvik; Kun Fang; R. Wayne Johnson

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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design

S. Perez, A.M. Francis, J. Holmes, T. Vrotsos

Novel Materials and Structures for Wide and Ultra-Wide Bandgap Semiconductor Switches

A. Christou

Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging

Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski

Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter

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