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Volume 2014, Issue DPC

1 January 2014

ISSN 2380-4491

Challenges and Directions in Mobile Device Packaging

Steve Bezuk

Mobile Packaging and Interconnect Trends

Brandon Prior

2.5D and 3D Integration Technology Update

Robert Patti

Non-Conductive Film (NCF) with No Voiding and High Reliability

Edgardo Anzures; Anupam Choubey; Avin Dhoble; David Fleming; Robert Barr; Jeffrey Calvert; Joon-Seok Oh

High Throughput Thin Wafer Support Technology for 3DIC

John Moore; Jared Pettit; David Young; Alman Law

3D Technology Applications Market Trends & Key Challenges

Thibault Buisson; Amandine Pizzagalli; Eric Mounier; Rozalia Beica

Reverse Engineering for the Purpose of Intellectual Property Protection and Accelerated Product Development in SOC and SIP Structures

Lajos (Louis) Burgyan; Yuji Kakizaki

Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling

Amy Palesko; Chet Palesko

Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip Packaging

Ibon Ocana

ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION

Susan Bagen; Dave Alcoe; Kim Blackwell; Frank Egitto

Electrical Performance Comparison between fcBGA and eWLB Packages

Kai Liu; YongTaek Lee; HyunTai Kim; MaPhooPwint Hlaing; Gwang. Kim; Susan Park; Billy Ahn

Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements

John Hunt; Adren Hsieh; Eddie Tsai; Chienfan Chen; Tsaiying Wang

Assembly Standardization for the Diverse Packaging Requirements of MEMS & Sensors

Russell Shumway

A Current-Controlled PCB Integrated MEMS Tilt Mirror

Robert N. Dean; Colin B. Stevens; John J. Tatarchuk

A Zinc Oxide nanowire-based Sensing Platform for Carbon Dioxide Detection

Bruce Kim; Anurag Gupta

Fatigue testing of bulk materials using a microsystems based approach

Li-Anne Liew; David T. Read; Nicholas Barbosa, III

ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)

Michael Kelly; Rick Reed

Next Generation High Power Electronic Modules Based on Embedded Power Semiconductors

Lars Böttcher; S. Karaszkiewicz; D. Manessis; Eckart Hoene; A. Ostmann

How to bring 3D IC to Maturity: Example of a pacemaker

Renzo DAL MOLIN

Optimized TSV Module for High Performance 2.5D Device Packaging

Cyprian Uzoh; Liang Wang; Zhuowen Sun; Andrew Cao; Bong-Sub Lee; Guilian Gao; Hong Shen; Sitaram Arkalgud

A cost effective PoP structure with high I/O density

Hongjie Wang; Weidong Huang; Fei Geng; Yuan Lu; Bo Zhang; Wen Yin; Haidong Wang

Embedding Active and Passive Devices in Medical Electronics

John Dzarnoski; Susie Johansson

A Flexible Manufacturing Method for Wafer Level Packages

Tom Strothmann; Damien Pricolo; Seung Wook Yoon; Yaojian Lin

Enabling Resist Processing Technologies for Advanced Packaging

Antun Peic; Thorsten Matthias; Johanna Bartl; Paul Lindner

Dielectric Laser Via Drilling for Next Generation Wafer Level Processing

Jim Zaccardi; Guy Burgess; Theodore Tessier; Ken Lafenhagen; Matt Souter

Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging

Jong-Uk Kim; Anupam Choubey; Rosemary Bell; Hua Dong; Michael Gallagher; Joe Lachowski; Masaki Kondo; Corey O'Connor; Greg Prokopowicz; Bob Barr; Dow Electronic Materials; Kai Zoschke; Matthias Wegner; Christina Lopper; Michael Toepper; Fraunhofer IZM

Solderability Challenges in Emerging BGA Packages

Maria Durham; Yan Liu; Andy Mackie

Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package

Wael Zohni; Rajesh Katkar; Rey Co; Rizza Cizek

All-silicon multi-chip modules based on ultra-thin active pixel radiation sensors

Ladislav Andricek

A PCB Technology Moisture Content and Electrical Conductivity Sensor Probe for Agricultural and Horticultural Applications

Robert N. Dean; Elizabeth Guertal; Adam Newby; Glenn Fain

2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES

David Fries; Chase StarrGeran Barton

A MEMS DC Current Sensor Utilizing Neodymium Rare Earth Magnets

John J. Tatarchuk; Colin B. Stevens; Robert N. Dean

Integrated Localized Cooling using Piezoelectrically-Driven Synthetic Jets

Michael Kranz; Tracy Hudson; Michael Whitley; Brian English

MEMS- Based Cryogenic Coolers - Micro Joule - Thomson Cryogenic Coolers

Yunda Wang; YC Lee

Die Stacking is Happening in Mainstream Computin

Bryan Black

TSV technology embedding high density capacitors for Advanced 3D packaging solutions

Catherine Bunel; Florent Lallemand

Progress in Fabrication and Test of Glass Interposer Substrates

Aric Shorey; Scott Pollard

New Lithography Requirements driven by 2.5D Interposer Manufacturing

Klaus Ruhmer; Joe Battaglia; Philippe Cochet

Precise solder dispensing in high-throughput micro-device packaging applications

Hanzhuang Liang; Linh Rolland; Floriana Suriawidjaja; Mani Ahmadi; Heakyoung Park

Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.

Brian Schmaltz; Yukinari Abe; Kazuyuki Kohara

Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding

Mustafa Oezkoek; Gustavo RamosArnd; KilianJens Wegricht

Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking

Syed Sajid Ahmad; Fred Haring; Greg Strommen; Kevin Mattson; Aaron Reinholz

Design Considerations and Ring-down Characteristics of Micromachined, High Current Density Capacitors

Aubrey N. Beal; John Tatarchuk; Colin Stevens; Thomas Baginski; Michael Hamilton; Robert N. Dean

Development of Passives on Sapphire Backside

Syed Sajid Ahmad; Cherish Bauer-Reich; Fred Haring; Greg Strommen; Kevin Mattson; Aaron Reinholz

Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip

Syed Sajid Ahmad; Fred Haring; Aaron Reinholz; Nathan Schneck

Efficient TSV Resist and Residue Removal in 3DIC

Kimberly Pollard; Meng Guo; Richie Peters; Mike Phenis; Laura Mauer; John Taddei; Ramey Youssef; John Clark

A New Type of TSV Defect Caused by BMD in Silicon Substrate

Dingyou Zhang; Sarasvathi Thangaraju; Daniel Smith; Himani Kamineni; Christian Klewer; Mark Scholefield; Ming Lei; Tong Qing Chen; Kumarapuram Gopalakrishnan; Abhishek Vikram; Victor Lim; Wonwoo Kim; Ramakanth Alapati

Next Generation Electrochemical Deposition TSV Fill

Bioh Kim; Stephen Golovato; Tyler Barbera; Keiichi Fujita; Takashi Tanaka

Metrology and Inspection for New Interconnects in Advanced Packaging

Russ Dudley; Matt Wilson; Rajiv Roy

Optimization of Lead Free Plating for Flip Chip Applications

Charles L. Arvin; Jurg Stahl; Wolfgang Sauter; Harry cox; Eric Perfecto; Valerie Oberson; Nathalie Normand

Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies

Inho Lee; Regina Cho; Lou Grippo; Yen-Lin Taylor; Wayne Baldelli; Ryan Farrell; Julia Woertink; Yi Qin; Jonathan Prange; Yil-Hak Lee; Masaaki Imanari; Jianwei Dong; Jeff Calvert

CupraEtch DE - Recyclable Anisotropic Etch: Differential Etch for SAP Manufacturing

Stephan Hotz; Rami Haidar; Sven Lamprecht; Norbert Luetzow

Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging

Koji Tatsumi; Kyouhei Mineo; Takeshi Hatta; Takuma Katase; Masayuki Ishikawa; Akihiro Masuda

Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin

Kenichiroh Mukai; Kwonil Kim; Brian Eastep; Lee Gaherty; Anirudh Kashyap; Lutz Brandt

Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping & Wafer Edge Inspection

Reza Asgari

A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)

Johann Weinhaendler; Rudolf Kaiser; Hardy Kellermann

A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy

Stephani Gulbrandsen; Joelle Arnold; Nick Kirsch; Greg Caswell

Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance

Liang Wang; Gabe Guevara; Rey Co; Ron Zhang; Roseann Alatorre

Trends in Automotive Packaging

Glenn G. Daves

Present and Future Applications of MEMS for Automotive Industry

Thibault Buisson

Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield

Thomas Uhrmann; Jürgen Burggraf; Harald Wiesbauer; Julian Bravin; Thorsten Matthias; Markus Wimplinger; Paul Lindner; Herman Meynen; Yann Civale; Ranjith John; Sheng Wang; Peng-Fei Fu; Craig Yeakle; Gary Aw

Adhesive Enabling Technology for Directly Plating Copper onto Glass

Lutz Brandt; Zhiming Liu; Hailuo Fu; Sara Hunegnaw; Tafadzwa Magaya

Magnetic Field Imaging for 3D applications

Jan Gaudestad; Antonio Orozco

Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks

Sohn Hong Seong; John Tracy

Applying system modeling to define 2.5 - d and 3 - d packaging roadmaps

Dev Gupta

Pathfinding and Design Optimization of 2.5D/3D devices in the context of multiple PCBs

Farhang Yazdani; John Park

Path Finding for Multiple Platforms

John Park

Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging

Yann Lamy; Haykel Ben Jamaa; Hughes Metras; Stéphane Bernabé; Sylvie Menezo; Laurent Fulbert

Thermal Aging of Optically Silicones

Michelle Velderrain; Michelle Poliskie

Pulsed 2 Micron Wavelength Fiber Lasers for Packaging

Shibin Jiang

UV-C LEDs for Sterilization Applications

Joe Grzyb

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Novel Materials and Structures for Wide and Ultra-Wide Bandgap Semiconductor Switches

A. Christou

Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging

Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski

Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter

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