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Volume 2014, Issue DPC
1 January 2014
Issue Cover
ISSN 2380-4491
Challenges and Directions in Mobile Device Packaging
Steve Bezuk
View Articletitled, Challenges and Directions in Mobile Device Packaging
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Mobile Packaging and Interconnect Trends
Brandon Prior
View Articletitled, Mobile Packaging and Interconnect Trends
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2.5D and 3D Integration Technology Update
Robert Patti
View Articletitled, 2.5D and 3D Integration Technology Update
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Non-Conductive Film (NCF) with No Voiding and High Reliability
Edgardo Anzures; Anupam Choubey; Avin Dhoble; David Fleming; Robert Barr; Jeffrey Calvert; Joon-Seok Oh
View Articletitled, Non-Conductive Film (NCF) with No Voiding and High Reliability
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High Throughput Thin Wafer Support Technology for 3DIC
John Moore; Jared Pettit; David Young; Alman Law
View Articletitled, High Throughput Thin Wafer Support Technology for 3DIC
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3D Technology Applications Market Trends & Key Challenges
Thibault Buisson; Amandine Pizzagalli; Eric Mounier; Rozalia Beica
View Articletitled, 3D Technology Applications Market Trends & Key Challenges
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Reverse Engineering for the Purpose of Intellectual Property Protection and Accelerated Product Development in SOC and SIP Structures
Lajos (Louis) Burgyan; Yuji Kakizaki
View Articletitled, Reverse Engineering for the Purpose of Intellectual Property Protection and Accelerated Product Development in SOC and SIP Structures
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Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling
Amy Palesko; Chet Palesko
View Articletitled, Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling
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Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip Packaging
Ibon Ocana
View Articletitled, Damage Induced in Interconnect Structures Mimicking Stresses During Flip Chip Packaging
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ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION
Susan Bagen; Dave Alcoe; Kim Blackwell; Frank Egitto
View Articletitled, ADVANCED ORGANIC SUBSTRATE TECHNOLOGIES FOR HIGH PERFORMANCE, HIGH RELIABILITY ELECTRONICS MINIATURIZATION
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Electrical Performance Comparison between fcBGA and eWLB Packages
Kai Liu; YongTaek Lee; HyunTai Kim; MaPhooPwint Hlaing; Gwang. Kim; Susan Park; Billy Ahn
View Articletitled, Electrical Performance Comparison between fcBGA and eWLB Packages
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Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements
John Hunt; Adren Hsieh; Eddie Tsai; Chienfan Chen; Tsaiying Wang
View Articletitled, Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements
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Assembly Standardization for the Diverse Packaging Requirements of MEMS & Sensors
Russell Shumway
View Articletitled, Assembly Standardization for the Diverse Packaging Requirements of MEMS & Sensors
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A Current-Controlled PCB Integrated MEMS Tilt Mirror
Robert N. Dean; Colin B. Stevens; John J. Tatarchuk
View Articletitled, A Current-Controlled PCB Integrated MEMS Tilt Mirror
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A Zinc Oxide nanowire-based Sensing Platform for Carbon Dioxide Detection
Bruce Kim; Anurag Gupta
View Articletitled, A Zinc Oxide nanowire-based Sensing Platform for Carbon Dioxide Detection
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Fatigue testing of bulk materials using a microsystems based approach
Li-Anne Liew; David T. Read; Nicholas Barbosa, III
View Articletitled, Fatigue testing of bulk materials using a microsystems based approach
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ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)
Michael Kelly; Rick Reed
View Articletitled, ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)
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Next Generation High Power Electronic Modules Based on Embedded Power Semiconductors
Lars Böttcher; S. Karaszkiewicz; D. Manessis; Eckart Hoene; A. Ostmann
View Articletitled, Next Generation High Power Electronic Modules Based on Embedded Power Semiconductors
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How to bring 3D IC to Maturity: Example of a pacemaker
Renzo DAL MOLIN
View Articletitled, How to bring 3D IC to Maturity: Example of a pacemaker
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Optimized TSV Module for High Performance 2.5D Device Packaging
Cyprian Uzoh; Liang Wang; Zhuowen Sun; Andrew Cao; Bong-Sub Lee; Guilian Gao; Hong Shen; Sitaram Arkalgud
View Articletitled, Optimized TSV Module for High Performance 2.5D Device Packaging
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A cost effective PoP structure with high I/O density
Hongjie Wang; Weidong Huang; Fei Geng; Yuan Lu; Bo Zhang; Wen Yin; Haidong Wang
View Articletitled, A cost effective PoP structure with high I/O density
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Embedding Active and Passive Devices in Medical Electronics
John Dzarnoski; Susie Johansson
View Articletitled, Embedding Active and Passive Devices in Medical Electronics
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A Flexible Manufacturing Method for Wafer Level Packages
Tom Strothmann; Damien Pricolo; Seung Wook Yoon; Yaojian Lin
View Articletitled, A Flexible Manufacturing Method for Wafer Level Packages
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Enabling Resist Processing Technologies for Advanced Packaging
Antun Peic; Thorsten Matthias; Johanna Bartl; Paul Lindner
View Articletitled, Enabling Resist Processing Technologies for Advanced Packaging
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Dielectric Laser Via Drilling for Next Generation Wafer Level Processing
Jim Zaccardi; Guy Burgess; Theodore Tessier; Ken Lafenhagen; Matt Souter
View Articletitled, Dielectric Laser Via Drilling for Next Generation Wafer Level Processing
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Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging
Jong-Uk Kim; Anupam Choubey; Rosemary Bell; Hua Dong; Michael Gallagher; Joe Lachowski; Masaki Kondo; Corey O'Connor; Greg Prokopowicz; Bob Barr; Dow Electronic Materials; Kai Zoschke; Matthias Wegner; Christina Lopper; Michael Toepper; Fraunhofer IZM
View Articletitled, Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging
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Solderability Challenges in Emerging BGA Packages
Maria Durham; Yan Liu; Andy Mackie
View Articletitled, Solderability Challenges in Emerging BGA Packages
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Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Wael Zohni; Rajesh Katkar; Rey Co; Rizza Cizek
View Articletitled, Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
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All-silicon multi-chip modules based on ultra-thin active pixel radiation sensors
Ladislav Andricek
View Articletitled, All-silicon multi-chip modules based on ultra-thin active pixel radiation sensors
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A PCB Technology Moisture Content and Electrical Conductivity Sensor Probe for Agricultural and Horticultural Applications
Robert N. Dean; Elizabeth Guertal; Adam Newby; Glenn Fain
View Articletitled, A PCB Technology Moisture Content and Electrical Conductivity Sensor Probe for Agricultural and Horticultural Applications
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2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES
David Fries; Chase StarrGeran Barton
View Articletitled, 2D PCB WITH 3D PRINT FABRICATIONS FOR RIGID-CONFORMAL PACKAGING OF MICROSENSOR IMAGING ARRAYS BASED ON BIOINSPIRED ARCHITECTURES
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A MEMS DC Current Sensor Utilizing Neodymium Rare Earth Magnets
John J. Tatarchuk; Colin B. Stevens; Robert N. Dean
View Articletitled, A MEMS DC Current Sensor Utilizing Neodymium Rare Earth Magnets
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Integrated Localized Cooling using Piezoelectrically-Driven Synthetic Jets
Michael Kranz; Tracy Hudson; Michael Whitley; Brian English
View Articletitled, Integrated Localized Cooling using Piezoelectrically-Driven Synthetic Jets
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MEMS- Based Cryogenic Coolers - Micro Joule - Thomson Cryogenic Coolers
Yunda Wang; YC Lee
View Articletitled, MEMS- Based Cryogenic Coolers - Micro Joule - Thomson Cryogenic Coolers
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Die Stacking is Happening in Mainstream Computin
Bryan Black
View Articletitled, Die Stacking is Happening in Mainstream Computin
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TSV technology embedding high density capacitors for Advanced 3D packaging solutions
Catherine Bunel; Florent Lallemand
View Articletitled, TSV technology embedding high density capacitors for Advanced 3D packaging solutions
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Progress in Fabrication and Test of Glass Interposer Substrates
Aric Shorey; Scott Pollard
View Articletitled, Progress in Fabrication and Test of Glass Interposer Substrates
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New Lithography Requirements driven by 2.5D Interposer Manufacturing
Klaus Ruhmer; Joe Battaglia; Philippe Cochet
View Articletitled, New Lithography Requirements driven by 2.5D Interposer Manufacturing
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Precise solder dispensing in high-throughput micro-device packaging applications
Hanzhuang Liang; Linh Rolland; Floriana Suriawidjaja; Mani Ahmadi; Heakyoung Park
View Articletitled, Precise solder dispensing in high-throughput micro-device packaging applications
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Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.
Brian Schmaltz; Yukinari Abe; Kazuyuki Kohara
View Articletitled, Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.
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Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
Mustafa Oezkoek; Gustavo RamosArnd; KilianJens Wegricht
View Articletitled, Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
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Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking
Syed Sajid Ahmad; Fred Haring; Greg Strommen; Kevin Mattson; Aaron Reinholz
View Articletitled, Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking
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Design Considerations and Ring-down Characteristics of Micromachined, High Current Density Capacitors
Aubrey N. Beal; John Tatarchuk; Colin Stevens; Thomas Baginski; Michael Hamilton; Robert N. Dean
View Articletitled, Design Considerations and Ring-down Characteristics of Micromachined, High Current Density Capacitors
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Development of Passives on Sapphire Backside
Syed Sajid Ahmad; Cherish Bauer-Reich; Fred Haring; Greg Strommen; Kevin Mattson; Aaron Reinholz
View Articletitled, Development of Passives on Sapphire Backside
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Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip
Syed Sajid Ahmad; Fred Haring; Aaron Reinholz; Nathan Schneck
View Articletitled, Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip
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Efficient TSV Resist and Residue Removal in 3DIC
Kimberly Pollard; Meng Guo; Richie Peters; Mike Phenis; Laura Mauer; John Taddei; Ramey Youssef; John Clark
View Articletitled, Efficient TSV Resist and Residue Removal in 3DIC
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A New Type of TSV Defect Caused by BMD in Silicon Substrate
Dingyou Zhang; Sarasvathi Thangaraju; Daniel Smith; Himani Kamineni; Christian Klewer; Mark Scholefield; Ming Lei; Tong Qing Chen; Kumarapuram Gopalakrishnan; Abhishek Vikram; Victor Lim; Wonwoo Kim; Ramakanth Alapati
View Articletitled, A New Type of TSV Defect Caused by BMD in Silicon Substrate
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Next Generation Electrochemical Deposition TSV Fill
Bioh Kim; Stephen Golovato; Tyler Barbera; Keiichi Fujita; Takashi Tanaka
View Articletitled, Next Generation Electrochemical Deposition TSV Fill
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Metrology and Inspection for New Interconnects in Advanced Packaging
Russ Dudley; Matt Wilson; Rajiv Roy
View Articletitled, Metrology and Inspection for New Interconnects in Advanced Packaging
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Optimization of Lead Free Plating for Flip Chip Applications
Charles L. Arvin; Jurg Stahl; Wolfgang Sauter; Harry cox; Eric Perfecto; Valerie Oberson; Nathalie Normand
View Articletitled, Optimization of Lead Free Plating for Flip Chip Applications
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Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
Inho Lee; Regina Cho; Lou Grippo; Yen-Lin Taylor; Wayne Baldelli; Ryan Farrell; Julia Woertink; Yi Qin; Jonathan Prange; Yil-Hak Lee; Masaaki Imanari; Jianwei Dong; Jeff Calvert
View Articletitled, Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
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CupraEtch DE - Recyclable Anisotropic Etch: Differential Etch for SAP Manufacturing
Stephan Hotz; Rami Haidar; Sven Lamprecht; Norbert Luetzow
View Articletitled, CupraEtch DE - Recyclable Anisotropic Etch: Differential Etch for SAP Manufacturing
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Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
Koji Tatsumi; Kyouhei Mineo; Takeshi Hatta; Takuma Katase; Masayuki Ishikawa; Akihiro Masuda
View Articletitled, Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
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Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin
Kenichiroh Mukai; Kwonil Kim; Brian Eastep; Lee Gaherty; Anirudh Kashyap; Lutz Brandt
View Articletitled, Adhesive Enabling Technology for Direct Metal Deposition on Molding Resin
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Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping & Wafer Edge Inspection
Reza Asgari
View Articletitled, Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping & Wafer Edge Inspection
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A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)
Johann Weinhaendler; Rudolf Kaiser; Hardy Kellermann
View Articletitled, A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)
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A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
Stephani Gulbrandsen; Joelle Arnold; Nick Kirsch; Greg Caswell
View Articletitled, A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
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Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance
Liang Wang; Gabe Guevara; Rey Co; Ron Zhang; Roseann Alatorre
View Articletitled, Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance
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Trends in Automotive Packaging
Glenn G. Daves
View Articletitled, Trends in Automotive Packaging
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Present and Future Applications of MEMS for Automotive Industry
Thibault Buisson
View Articletitled, Present and Future Applications of MEMS for Automotive Industry
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Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
Thomas Uhrmann; Jürgen Burggraf; Harald Wiesbauer; Julian Bravin; Thorsten Matthias; Markus Wimplinger; Paul Lindner; Herman Meynen; Yann Civale; Ranjith John; Sheng Wang; Peng-Fei Fu; Craig Yeakle; Gary Aw
View Articletitled, Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
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Adhesive Enabling Technology for Directly Plating Copper onto Glass
Lutz Brandt; Zhiming Liu; Hailuo Fu; Sara Hunegnaw; Tafadzwa Magaya
View Articletitled, Adhesive Enabling Technology for Directly Plating Copper onto Glass
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Magnetic Field Imaging for 3D applications
Jan Gaudestad; Antonio Orozco
View Articletitled, Magnetic Field Imaging for 3D applications
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Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks
Sohn Hong Seong; John Tracy
View Articletitled, Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks
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Applying system modeling to define 2.5 - d and 3 - d packaging roadmaps
Dev Gupta
View Articletitled, Applying system modeling to define 2.5 - d and 3 - d packaging roadmaps
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Pathfinding and Design Optimization of 2.5D/3D devices in the context of multiple PCBs
Farhang Yazdani; John Park
View Articletitled, Pathfinding and Design Optimization of 2.5D/3D devices in the context of multiple PCBs
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Path Finding for Multiple Platforms
John Park
View Articletitled, Path Finding for Multiple Platforms
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Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging
Yann Lamy; Haykel Ben Jamaa; Hughes Metras; Stéphane Bernabé; Sylvie Menezo; Laurent Fulbert
View Articletitled, Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging
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Thermal Aging of Optically Silicones
Michelle Velderrain; Michelle Poliskie
View Articletitled, Thermal Aging of Optically Silicones
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Pulsed 2 Micron Wavelength Fiber Lasers for Packaging
Shibin Jiang
View Articletitled, Pulsed 2 Micron Wavelength Fiber Lasers for Packaging
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UV-C LEDs for Sterilization Applications
Joe Grzyb
View Articletitled, UV-C LEDs for Sterilization Applications
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All Issues
  • ISSN 2380-4491
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