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Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging
Jong-Uk Kim; Anupam Choubey; Rosemary Bell; Hua Dong; Michael Gallagher; Joe Lachowski; Masaki Kondo; Corey O'Connor; Greg Prokopowicz; Bob Barr; Dow Electronic Materials; Kai Zoschke; Matthias Wegner; Christina Lopper; Michael Toepper; Fraunhofer IZM
Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
Thomas Uhrmann; Jürgen Burggraf; Harald Wiesbauer; Julian Bravin; Thorsten Matthias; Markus Wimplinger; Paul Lindner; Herman Meynen; Yann Civale; Ranjith John; Sheng Wang; Peng-Fei Fu; Craig Yeakle; Gary Aw
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez, A.M. Francis, J. Holmes, T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter