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Volume 2016, Issue CICMT

1 May 2016

ISSN 2380-4491

Stereolithographic Additive Manufacturing of Bulky Ceramic Components with Functionally Geometric Micropattern

Soshu Kirihara

View Articletitled, Stereolithographic Additive Manufacturing of Bulky Ceramic Components with Functionally Geometric Micropattern

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Stereolithographic Additive Manufacturing of Solid Electrolyte Ceramic Sheets with Micro Emboss Pattern for All Solid Battery Application

Koki Nonaka; Soshu Kirihara

View Articletitled, Stereolithographic Additive Manufacturing of Solid Electrolyte Ceramic Sheets with Micro Emboss Pattern for All Solid Battery Application

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Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor Applications

Rena Gradmann; Thomas Seuthe; Christian Vedder; Markus Eberstein; Uwe Partsch

View Articletitled, Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor Applications

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Sensor stack for Tian-Calvet Calorimeter made in LTCC-Technology

Franz Schubert; Jaroslaw Kita; Michael Gollner; Florian Linseis; Ralf Moos

View Articletitled, Sensor stack for Tian-Calvet Calorimeter made in LTCC-Technology

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Fabrication, response and stability of miniature piezoresistive force-sensing thick-film cantilevers

Thomas Maeder; Caroline Jacq; Stefane Caseiro; Peter Ryser

View Articletitled, Fabrication, response and stability of miniature piezoresistive force-sensing thick-film cantilevers

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Design of a Low Inductance Power Module Based on Low Temperature Co-fired Ceramic

Atanu Dutta; Simon S. Ang

View Articletitled, Design of a Low Inductance Power Module Based on Low Temperature Co-fired Ceramic

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Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter

Wenli Zhang; Yipeng Su; Fred C. Lee

View Articletitled, Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter

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LTCC Breakdown Voltage Investigation

Mateusz Dorczynski; Wiktoria Fabinska; Henryk Roguszczak; Leszek Golonka

View Articletitled, LTCC Breakdown Voltage Investigation

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Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

Jaroslaw Kita; Sven Wiegärtner; Alistair Prince; Peter Weigand; Ralf Moos

View Articletitled, Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

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Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor

Caroline Jacq; Thomas Maeder; Benoit R. Ellenrieder; Philipp Windischhofer; Xinyue Jiang; Matthieu Toussaint; Duccio Testa; Peter Ryser

View Articletitled, Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor

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The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer

Sayan Seal; Michael D. Glover; H. Alan Mantooth

View Articletitled, The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer

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Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates

Paul Gundel; Anton Miric; Kai Herbst; Melanie Bawohl; Jessica Reitz; Christina Modes; Gabriel Zier; Ilias Nikolaidis; Mark Challingsworth

View Articletitled, Advanced DBC - Highly Reliable and Conductive Copper Ceramic Substrates

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Design and Fabrication of Ceramic Microsystem Utilizing Glow Discharge for Analysis of Liquid Mixtures

Jan Macioszczyk; Monika Lenartowicz; Karol Malecha; Leszek J. Golonka

View Articletitled, Design and Fabrication of Ceramic Microsystem Utilizing Glow Discharge for Analysis of Liquid Mixtures

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Fabrication of LTCC Micro-fluidic Devices For Wireless Lab-On-A-Chip Applications

Achraf Ben Amar; Houssem Eddine Amor; Hung Cao; Ammar B. Kouki

View Articletitled, Fabrication of LTCC Micro-fluidic Devices For Wireless Lab-On-A-Chip Applications

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MEMS Fabrication on LTCC Substrates for RF Applications: Challenges and Perspectives

Dorra Bahloul; Achraf Ben Amar; Ammar B. Kouki

View Articletitled, MEMS Fabrication on LTCC Substrates for RF Applications: Challenges and Perspectives

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LTCC 3D MICROMIXERS FOR NON-MISCIBLE FLUIDS MICROEMULSION GENERATION

Houari Cobas Gomez; Bianca Oliveira Agio; Jéssica Gonçalves da Silva; Natalia Neto Pereira Cerize; Adriano Marim de Oliveira; Kleber Lanigra Guimaraes; Marcio Rodrigues da Cunha; Antonio Carlos Seabra; Mario Ricardo Gongora-Rubio

View Articletitled, LTCC 3D MICROMIXERS FOR NON-MISCIBLE FLUIDS MICROEMULSION GENERATION

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High Resolution LTCC Laser Processing in the Green and Fired State for Future Technologies

Nam Gutzeit; Tilo Welker; Karl-Heinz Drüe; Jens Müller

View Articletitled, High Resolution LTCC Laser Processing in the Green and Fired State for Future Technologies

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Investigations of Metal Systems in a Silicon Ceramic Composite Substrate for Electrical and Thermal Contacts as well as Associated Mounting Aspects

M. Fischer; T. Welker; B. Leistritz; S. Gropp; C. Schäffel; M. Hoffmann; J. Müller

View Articletitled, Investigations of Metal Systems in a Silicon Ceramic Composite Substrate for Electrical and Thermal Contacts as well as Associated Mounting Aspects

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LTCC 3D FLOW FOCALIZATION DEVICE FOR LIQUID-LIQUID PARTIAL SOLVENT EXTRACTION

Houari Cobas Gomez; Jéssica Gonçalves da Silva; Jocasta Mileski Machado; Bianca Oliveira Agio; Francisco Jorge Soares de Oliveira; Antonio Carlos Seabra; Mario Ricardo Gongora-Rubio

View Articletitled, LTCC 3D FLOW FOCALIZATION DEVICE FOR LIQUID-LIQUID PARTIAL SOLVENT EXTRACTION

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Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrate

S. Gropp; M. Fischer; A. Frank; C. Schäffel; J. Müller; M. Hoffmann

View Articletitled, Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrate

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Integrated Microchannel Cooling for Power Electronic Modules

Wenli Zhang; Fengchang Yang; Rui Qiao; Dushan Boroyevich

View Articletitled, Integrated Microchannel Cooling for Power Electronic Modules

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Novel Glass-free LTCC Material co-fired with Cupper-Electrodes

Yasutaka Sugimoto; Tsuyoshi Katsube; Machiko Motoya; Yuki Takemori; Yoichi Moriya; Kazuo Kishida; Takahiro Takada; Nobuhiko Tanaka

View Articletitled, Novel Glass-free LTCC Material co-fired with Cupper-Electrodes

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The Effect of Firing Temperature on Structure and Electrical Properties in Low Temperature Co-fired Ceramics

Jim Walker; John Maloney; Cody Gleason; Jeff Holthus; Bradford Smith; Jim Henry; Ed Graddy; Sid Sridharan; George Sakoske

View Articletitled, The Effect of Firing Temperature on Structure and Electrical Properties in Low Temperature Co-fired Ceramics

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LTCC Thick Film Process Characterization

M. A. Girardi; K. A. Peterson; P. T. Vianco

View Articletitled, LTCC Thick Film Process Characterization

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Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film

Yoshihiko Imanaka; Hideyuki Amada; Fumiaki Kumasaka; Naoki Awaji

View Articletitled, Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film

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Flexible Thin Film Coating by Photo-assisted Chemical Solution Process

Tetsuo Tsuchiya; T. Nakajima; I. Yamaguchi; H. Matusi; T. Nakamura

View Articletitled, Flexible Thin Film Coating by Photo-assisted Chemical Solution Process

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High-Temperature Dielectric Materials from Atomically-Thin Perovskites

Minoru Osada; Takayoshi Sasaki

View Articletitled, High-Temperature Dielectric Materials from Atomically-Thin Perovskites

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A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits

Jim Holmes; A. Matthew Francis; Ian Getreu; Michael Glover

View Articletitled, A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits

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Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)

Carol Putman; Rachel Cramm Horn; Ambrose Wolf; Daniel Krueger

View Articletitled, Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)

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Wire-bondable multilayer ceramic capacitors

Yan Gu; Yilong Feng; Junfeng Yang; Zhifu Liu; Tong Zhuang; Yongxiang Li

View Articletitled, Wire-bondable multilayer ceramic capacitors

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A comparative study on four different transmission lines in LTCC for 60 GHz applications

A. Isapour; D. Bahloul; A. B. Kouki

View Articletitled, A comparative study on four different transmission lines in LTCC for 60 GHz applications

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Microwave Filter Design Optimized for Ceramic Multilayer Technique

Peter Uhlig; Juergen Kassner; Carsten Guenner; Elke Noack

View Articletitled, Microwave Filter Design Optimized for Ceramic Multilayer Technique

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Microwave Characterization of a Thick Film System for Hybrid Packaging Applications

Bradley A. Thrasher; Michael A. Skurski; Ken E. Souders; James M. Parisi

View Articletitled, Microwave Characterization of a Thick Film System for Hybrid Packaging Applications

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RF Sensor Modules – Needs for Multifunctional Architectures

Martin Oppermann; Felix Thurow; Ralf Rieger

View Articletitled, RF Sensor Modules – Needs for Multifunctional Architectures

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