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Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology
Steffen Kroehnert; Jose Campos; André Cardoso; Mariana Pires; Eoin O'Toole; Raquel Pinto; Emilie Jolivet; Thomas Uhrmann; Elizabeth Brandl; Jürgen Burggraf; Harald Wiesbauer; Julian Bravin; Markus Wimplinger; Paul Lindner
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez, A.M. Francis, J. Holmes, T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter