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Volume 2016, Issue DPC

1 January 2016

ISSN 2380-4491

2.5D / 3D IC Landscape: Market and Technology Trends

Andrej Ivankovic; Thibault Buisson; Amandine Pizzagalli; Dave Towne; Rozalia Beica

Testing in-package DRAMs and DFX features in 3D high-bandwidth memory

Chris Nelson

Cost Breakdown of 2.5D and 3D Packaging

Chet Palesko; Amy Palesko

Impact of electrical and thermal stresses on TSV radiofrequency performance

Anh Phuong NGUYEN; Ulrike Lüders; Frederic Voiron

Embedded RDL Enabled by Excimer Laser Ablation

Habib Hichri

Extending WLCSP Packaging Technology Capabilities to Enable Miniaturized Sensor and MEMS Packaging Applications

Ted Tessier

Characterization of Clean after Photoresist Removal from Wafers with Copper Pillars with Lead-Free Solder Caps

Kimberly Pollard; Richie Peters; Michael Phenis; Don Pfettscher

Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor

Maaike M. Visser Taklo; Branson Belle; Joachim Seland Graff; Astrid-Sofie Vardøy; Elisabeth Ramsdal

Advances in Aligned Wafer Bonding Enable by High Vacuum Processing

Eric F. Pabo; Christoph Floetgen; Bernhard Rebhan; Razek Nasser

3D Printing of High Voltage Printed Wiring Boards

Eric MacDonald; Ryan Wicker; David Espalin; Andy Kwas; Peter Ruby Craig Kief

System level IC packaging - Integration of Key Technologies: TSVs, Interposers, and Advanced IC Packaging

Mike Kelly; Dave Hiner; Marnie Mattei; Rick Reed; Paul Silvestri; Ron Huemoeller

Impact of Top Die Thickness on Cu Pillar Fatigue in Exposed Die 3D Packages

Rahul Agarwal; Sukesh Kannan; Shan Gao; Rick Reed; Yong Song; JS Paek

High Speed Electroplating of 200um High Cu Bumps for Die Stacking Architectures

Richard Hollman

Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications

Matthew A Thorseth; Mark Scalisi; Inho Lee; Sang-Min Park; Yil-Hak Lee; Jonathan Prange; Masaaki Imanari; Mark Lefebvre; Jeff Calvert

First Integration Steps of Cu-based DNA Nanowires for interconnections

Christophe Brun; Corentin Carmignani; Cheikh Tidiane-Diagne; Simona Torrengo; Pierre-Henri Elchinger; Patrick Reynaud; Aurélie Thuaire; Severine Cheramy; Didier Gasparutto; Raluca Tiron; Arianna Filoramo; Xavier Baillin

Current status and future prospects of panel level packaging

Santosh Kumar; Amandine Pizzagalli; Dave Towne; Thibault Buisson; Andrej Ivankovic; Rozalia Beica

M-Series with Adaptive Patterning for High-Yield Fan-Out SIP

Craig Bishop; Suresh Jayaraman; Boyd Rogers; Chris Scanlan; Tim Olson

Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology

Steffen Kroehnert; Jose Campos; André Cardoso; Mariana Pires; Eoin O'Toole; Raquel Pinto; Emilie Jolivet; Thomas Uhrmann; Elizabeth Brandl; Jürgen Burggraf; Harald Wiesbauer; Julian Bravin; Markus Wimplinger; Paul Lindner

Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

Bernard Adams; Won Kyung Choi; Duk Ju Na; Andy Yong; Seung Wook Yoon; Jaesik Lee; Urmi Ray; Riko Radojcic

A study on warpage behavior of EMC in post-mold cure stage using Moldex3D

Hsu Chih-Chung; Srikar Vallury; Kai Lin; Anthony Yang

A MEMS PPA Based Active Vibration Isolator - STUDENT AWARD 3RD PLACE $500

Chong Li; C. Lavinia Elana; Robert N. Dean; George T. Flowers

Enhancements of an In Situ Atmospheric System for Real Time Weather Monitoring

Mark L. Adams; Audrey Rose Shapland; Matthew Gutierrez; Haley Harrell; Jessica Blume; Craig Prather

Terahertz Diode Arrays and Differential Probes based on Heterogeneous Integration and Silicon Micromachining

Robert M. Weikle; C. Zhang; S. Hawasli; S. Nadri; L. Xie; N. Scott Barker; A.W. Lichtenberger

Packaging and Assembly Challenges for 2.5D/3D Devices

Gerald Beyer; Kenneth Rebibis; Arnita Podpod; Francisco Cadacio; Teng Wang; Andy Miller; Eric Beyne

Non-Conductive Film (NCF) Underfill: Materials, Performance, and Evolution to Next Generation Devices

Edgardo Anzures; Paul Morganelli; Robert Barr; Jeffrey Calvert; Avin Dhoble; David Fleming; Jong-Uk Kim; Herong Lei; Jürgen Grafe; Julian Haberland

Laser Direct Patterning of Dry Etch BCB Adhesive Layers for Low Temperature Permanent Wafer-to-Wafer Bonding

Kai Zoschke; J.-U. Kim; M. Wegner; M. Gallagher; R. Barr; J. Calvert; M. Toepper; K.-D. Lang

Critical Process Parameters And Failure Analysis For Temporary Bonded Wafer Stacks

Elisabeth Brandl; Karine Abadie; Markus Wimplinger; Juergen Burggraf; Thomas Uhrmann; Julian Bravin; Frank Fournel; Pierre Montmeat

TCB Process Options to Achieve the Lowest Cost

Tom Strothmann

Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer Applications

Tom Swarbrick; Keith Best; Casey Donaher; Steve Gardner

Advancements in Flip Chip Assembly Equipment and Processes

Bob Chylak; Horst Clauberg; Daniel Buergi

Emerging Flux Challenges for BGA Packages

Maria Durham; Andy Mackie; Jason Chou

Precise, high throughput dispensing of thermal interface material in BGA packaging applications

Hanzhuang Liang; Linh Rolland

Washable Coatings for Packaging Practices

John Moore; Alex Brewer

Improvements in Decision Making Criteria for Thermal Warpage

Neil Hubble

A Survey of Nonlinear Phenomena and Chaos in Microsystems and Packaging

Aubrey N. Beal; Robert N. Dean

Nonlinear dynamics induced anomalous Hall effect in topological insulators

Guanglei Wang; Hongya Xu; Ying-Cheng Lai

A Novel Third Order Analog Chaotic Oscillator

Benjamin K. Rhea; Frank T. Werner; Remington C. Harrison; Robert N. Dean

Nonlinear Dynamics and Chaos in Micro/Nano-Scale Systems and Applications

Ying-Cheng Lai

A Matched Filter Developed for Chaotic Waveforms

Frank T. Werner; Benjamin K. Rhea; Aubrey N. Beal; William E. Abell; John P. Bailey; Remington C. Harrison; Robert N. Dean; Michael C. Hamilton

Nonlinear Observability Analysis of Micro-machined Electrostatic Actuators Using Self-Sensing

Chong Li; Robert N. Dean; George T. Flowers

Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform

Miguel Jimarez

Innovated L/S less than 2/2μm Line Embedded 2.1D Organic Substrate Technology

Yu-Hua Chen

Why Mold When You Can NanoTech?

Simon McElrea

SiP Technology Trends

Hamid Eslampour

Investigation of Warpage Behavior of Silicon Semiconductor on a Silicon - Adhesive - Ceramic Integrated Structure at Cryogenic Temperatures--STUDENT BEST PAPER $1500

Eyup Can Baloglu; Tuba Okutucu Ozyurt; Zafer Dursunkaya

The Direct plating copper (DPC) ceramic material on Al2O3/AlN or LTCC (Low-temperature co-fired ceramic) substrates

Ho-Chieh (Jay) Yu; Jason Huang

Advancements in Glass for Packaging Applications

Kevin Adriance; Gene Smith; Aric Shorey; Rachel Lu

Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application

Yu-Hua Chen; Yu-Chung Hsieh; Wei-Di Lin; Chun-Hsien Chien; Dyi-Chung Hu

Embedded Die Packages and Modules for Power Electronics Applications

Lars Boettcher; S. Karaszkiewicz; D. Manessis; A. Ostmann

Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature

Stephan Borel; P. Descours; B. Goubault; P. Nicolas; R. Franiatte; G. Parat; M. Pommier; S. Yon; G. Simon; C. Bunel

Low profile Flip-Type or Embedded Silicon Capacitors for decoupling

Catherine Bunel; Franck Murray

How Mitigation Techniques Affect Reliability Results for BGAs

Greg Caswell; Melissa Keener

Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

Swapan Bhattacharya; Fei Xie; Daniel F. Baldwin; Han Wu; Kelley Hodge; Qing Ji

Numerical Simulation of Copper Migration in Single Crystal CdTe

Da Guo; Dragica Vasileska

Preserving Nb Superconducvity in Thin Film Flexible Structures

Vaibhav Gupta; John A. Sellers; Charles D. Ellis; Simin Zou; George A. Hernandez; Rujun Bai; Yang Cao; David B. Tuckerman; Michael C. Hamilton

A Multiscale Modeling Approach to Study Transport in Silicon Heterojunction Solar Cells

Pradyumna Muralidharan; Stuart Bowden; Stephen M. Goodnick; Dragica Vasileska

Design of TSV-based Inductors for Internet of Things

Bruce C Kim; Saikat Mondal

Design of high density SiP for complex computing system in micro SD format

Chris Baratt

An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield

Nozad Karim; Rong Zhou; Jun Fan

Laser-based Package Singulation and Trenching for SiP

Dirk Mueller; David Clark; Joris VanNunen; Ed Rea; Hatim Haloui

Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technology

Heidi Lundén; Antti Peltonen; Antti Määttänen

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Novel Materials and Structures for Wide and Ultra-Wide Bandgap Semiconductor Switches

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Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging

Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski

Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter

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