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Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology
Steffen Kroehnert; Jose Campos; André Cardoso; Mariana Pires; Eoin O'Toole; Raquel Pinto; Emilie Jolivet; Thomas Uhrmann; Elizabeth Brandl; Jürgen Burggraf; Harald Wiesbauer; Julian Bravin; Markus Wimplinger; Paul Lindner
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez<span class='al-author-delim'>, </span>A.M. Francis<span class='al-author-delim'>, </span>J. Holmes<span class='al-author-delim'>, </span>T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig<span class='al-author-delim'>, </span>Sebastian Holtkämper<span class='al-author-delim'>, </span>Lars Helmich<span class='al-author-delim'>, </span>Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert<span class='al-author-delim'>, </span>Sebastian Braun<span class='al-author-delim'>, </span>Norbert Kordas<span class='al-author-delim'>, </span>Andre Kosfeld<span class='al-author-delim'>, </span>Alexander Utz<span class='al-author-delim'>, </span>Constanze Weber<span class='al-author-delim'>, </span>Olaf Rämer<span class='al-author-delim'>, </span>Malte Spanier<span class='al-author-delim'>, </span>Martin Ihle<span class='al-author-delim'>, </span>Steffen Ziesche<span class='al-author-delim'>, </span>Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler<span class='al-author-delim'>, </span>Svetlana Lukich<span class='al-author-delim'>, </span>Raul DePersia<span class='al-author-delim'>, </span>Chase Guilbeau<span class='al-author-delim'>, </span>Mark Carter
