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Volume 2016, Issue HiTEC
1 May 2016
Issue Cover
ISSN 2380-4491
HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
Holger Vogt; Frank Altmann; Sebastian Braun; Yusuf Celik; Lothar Dietrich; Dorothee Dietz; Marius van Dijk; Stefan Dreiner; Ralf Doering; Felix Gabler; Andreas Goehlich; Matthias Hutter; Martin Ihle; Holger Kappert; Norbert Kordas; Rainer Kokozinski; Falk Naumann; Torsten Nowak; Hermann Oppermann; Uwe Partsch; Matthias Petzold; Frank Roscher; Sven Rzepka; Ralph Schubert; Constanze Weber; Maik Wiemer; Olaf Wittler; Steffen Ziesche
View Articletitled, HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
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High Reliability Electronics for Demanding Aircraft Applications – An Overview
Roger Brewer
View Articletitled, High Reliability Electronics for Demanding Aircraft Applications – An Overview
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Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly
Erick M. Spory
View Articletitled, Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly
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A 200C capable embedded EEPROM
Dean Allum; Tomas Drajsajtl; Radomir Plachejda; Stanislav Seleznev; Richard Wheelus
View Articletitled, A 200C capable embedded EEPROM
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A 225C Geothermal Logging Tool
Marshall Soares; Randy Normann; Bruce Ohme
View Articletitled, A 225C Geothermal Logging Tool
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High Precision Analog Multiplexers Enable Multi-Channel Data Acquisition in High Temperature Environments
Jeff Watson; Stephen Kavanagh; Stephen Nugent
View Articletitled, High Precision Analog Multiplexers Enable Multi-Channel Data Acquisition in High Temperature Environments
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System On Chip (SOC) ASIC chipset for Smart Actuators in Distributed Propulsion Systems
Bhal Tulpule; Alireza R. Behbahani
View Articletitled, System On Chip (SOC) ASIC chipset for Smart Actuators in Distributed Propulsion Systems
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High temperature / radiation hardened capable ARM® Cortex®-M0 microcontrollers
R. Bannatyne; D. Gifford; K. Klein; C. Merritt
View Articletitled, High temperature / radiation hardened capable ARM® Cortex®-M0 microcontrollers
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Towards Integrated Sensors for Environments with Temperatures up to 600 °C
Ayden Maralani; Levent Beker; Albert P. Pisano
View Articletitled, Towards Integrated Sensors for Environments with Temperatures up to 600 °C
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Co-fired Platinum High Temperature Sensor Element
Tsutomu Sugawara; Hiroshi Matsumoto; Hiroki Ito; Shingo Sato; Masanari Kokubu
View Articletitled, Co-fired Platinum High Temperature Sensor Element
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High Temperature Potting Materials for Wire Bond Encapsulation
David Shaddock; Liang Yin
View Articletitled, High Temperature Potting Materials for Wire Bond Encapsulation
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Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package
Liang-Yu Chen; Philip G. Neudeck; David J. Spry; Glenn M. Beheim; Gary W. Hunter
View Articletitled, Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package
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Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems
David L. Saums; Robert A. Hay
View Articletitled, Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems
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Metallic TIM Testing and Selection for Harsh Environment Applications for GaN RF Semiconductors
Tim Jensen; David L. Saums
View Articletitled, Metallic TIM Testing and Selection for Harsh Environment Applications for GaN RF Semiconductors
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Encapsulation Method for Small Wireless Measurement Systems in High Temperature Environments
J. Johansson; J. Borg
View Articletitled, Encapsulation Method for Small Wireless Measurement Systems in High Temperature Environments
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Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds
Subramani Manoharan; Chandradip Patel; Patrick McCluskey
View Articletitled, Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds
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Improving Efficiency in Downhole Power Converters using GaN Technology
Gary Hanington
View Articletitled, Improving Efficiency in Downhole Power Converters using GaN Technology
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A CMOS SiC Linear Voltage Regulator for High Temperature Applications
R.C. Murphree; S. Ahmed; M. Barlow; A. Rahman; H.A. Mantooth; A. M. Francis
View Articletitled, A CMOS SiC Linear Voltage Regulator for High Temperature Applications
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High Temperature GaN Gate Driver in SOI CMOS Technology
Holger Kappert; Sebastian Braun; Norbert Kordas; Stefan Dreiner; Rainer Kokozinski
View Articletitled, High Temperature GaN Gate Driver in SOI CMOS Technology
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High-Temperature Self-Supplied Isolated Driver Module for GaN Power Transistors
Xavier Baie; Vincent Dessard; René Escoffier; Fabien Laplace; Gonzalo Picun
View Articletitled, High-Temperature Self-Supplied Isolated Driver Module for GaN Power Transistors
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Development of BiAgX® HT Solder Paste for 200°C Application
Hongwen Zhang; Jonathan Minter; Ning-Cheng Lee
View Articletitled, Development of BiAgX® HT Solder Paste for 200°C Application
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Silver Sintering Paste Rendering Low Porosity Joint for High Power Die Attach Application
Sihai Chen; Christine LaBarbera; Ning-Cheng Lee
View Articletitled, Silver Sintering Paste Rendering Low Porosity Joint for High Power Die Attach Application
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Effect of isothermal aging at 250 °C on shear strength of joints using Au nanoporous bonding for die attach
H. Nishikawa; K. Matsunaga; M-S. Kim; M. Saito; J. Mizuno
View Articletitled, Effect of isothermal aging at 250 °C on shear strength of joints using Au nanoporous bonding for die attach
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A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient
Xin Zhao; Haotao Ke; Yifan Jiang; Adam Morgan; Yang Xu; Douglas C. Hopkins
View Articletitled, A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient
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Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules
Sayan Seal; Michael D. Glover; H. Alan Mantooth
View Articletitled, Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules
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Degradation Analysis of TO-247 Package SiC-MOSFETs Subjected to High Temperature Storage and Heavy Thermal Cycle Test
Sawa Araki; Tatsuhiro Suzuki; Mari Yamashita; Satoshi Tanimoto; Toshiaki Ono; Hisashi Yakumaru; Hiroki Sawada
View Articletitled, Degradation Analysis of TO-247 Package SiC-MOSFETs Subjected to High Temperature Storage and Heavy Thermal Cycle Test
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Design and Testing of a High Temperature Inverter
Shashank Krishnamurthy; Stephen Savulak; Yang Wang
View Articletitled, Design and Testing of a High Temperature Inverter
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Down-hole switching-mode power supply using a remote CA start up pulse
Rito Mijarez; Angel Gomez; David Pascacio; Ivan Martinez; Ricardo Guevara
View Articletitled, Down-hole switching-mode power supply using a remote CA start up pulse
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Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme Environments
Stanley A. Ikpe; Jean-Marie Lauenstein; Gregory A. Carr; Don Hunter; Lawrence L. Ludwig; William Wood; Linda Y. Del Castillo; Mohammad M. Mojarradi; Fred Fitzpatrick; Yuan Chen
View Articletitled, Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme Environments
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Internal Structure Refinement of Porous Sintered Silver via Electromigration
Ali Mansourian; Seyed Amir Paknejad; Qiannan Wen; Khalid Khtatba; Anatoly V. Zayats; Samjid H. Mannan
View Articletitled, Internal Structure Refinement of Porous Sintered Silver via Electromigration
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Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders
Martin Wickham; Kate Clayton; Ana Robador; Chris Hunt; Robin Pittson; Laura Statton; Tina Brown; Fiona Lambert; Tracy Wotherspoon
View Articletitled, Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders
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Method to Determine Maximum Allowable Sinterable Silver Interconnect Size
A. A. Wereszczak; M. C. Modugno; S. B. Waters; D. J. DeVoto; P. P. Paret
View Articletitled, Method to Determine Maximum Allowable Sinterable Silver Interconnect Size
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Towards High Temperature Electronic Modules in which all Components would be attached using Silver Sintering
Thomas GEOFFROY; Jean-Christophe RIOU; Yves BIENVENU; Corinne PONS; Sylvain MEILLE; Eric BAILLY
View Articletitled, Towards High Temperature Electronic Modules in which all Components would be attached using Silver Sintering
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Component Attachment with Pressureless Sintering for 300°C Applications
Fang Yu; Jinzi Cui; Zhangming Zhou; R. Wayne Johnson; Michael C. Hamilton
View Articletitled, Component Attachment with Pressureless Sintering for 300°C Applications
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Toward Interpreting Failure in Sintered-Silver Interconnection Systems†
M. C. Modugno; A. A. Wereszczak; S. B. Waters
View Articletitled, Toward Interpreting Failure in Sintered-Silver Interconnection Systems<sup>†</sup>
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High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application
A. Matthew Francis; Jim Holmes; Nick Chiolino; Matthew Barlow; Affan Abbasi; H. Alan Mantooth
View Articletitled, High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application
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Processing and Characterization of Thousand-Hour 500 °C Durable 4H-SiC JFET Integrated Circuits
David J. Spry; Philip G. Neudeck; Liang-Yu Chen; Dorothy Lukco; Carl W. Chang; Glenn M. Beheim; Michael J. Krasowski; Norman F. Prokop
View Articletitled, Processing and Characterization of Thousand-Hour 500 °C Durable 4H-SiC JFET Integrated Circuits
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Low Power Silicon Carbide RS-485 Transceiver
M. R. Benavides; A. N. Castillo; A. Rahman; M. Barlow; D. Abreu; C. Rowlett; H. A. Mantooth; A. M. Francis; J. A. Holmes
View Articletitled, Low Power Silicon Carbide RS-485 Transceiver
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First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
Philip G. Neudeck; David J. Spry; Liang-Yu Chen
View Articletitled, First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
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A High Temperature Passive GaN-HEMT Mixer for Downhole Communications
Jebreel M. Salem; Dong Sam Ha
View Articletitled, A High Temperature Passive GaN-HEMT Mixer for Downhole Communications
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Nanocomposite Film Dielectrics for High Temperature Power Conditioning Capacitors
Kirk Slenes; Dale Perry; Lew Bragg
View Articletitled, Nanocomposite Film Dielectrics for High Temperature Power Conditioning Capacitors
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Aerospace Performances of IPDiA −250°C up to 250°C Grade Silicon Capacitors
Laurent Lengignon; Sebastien Leruez
View Articletitled, Aerospace Performances of IPDiA −250°C up to 250°C Grade Silicon Capacitors
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C0G and X7R Ceramic Capacitors for High Temperature Applications
Abhijit Gurav; Jim Magee; Reggie Phillips; Scott Carson
View Articletitled, C0G and X7R Ceramic Capacitors for High Temperature Applications
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Tantalum Capacitor Technology Options for High Temperature and Harsh Environment Applications
Chris Reynolds
View Articletitled, Tantalum Capacitor Technology Options for High Temperature and Harsh Environment Applications
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AVX High Temperature Products for Surface Mount and SMPS Applications
Dave Dupre; Patrick German
View Articletitled, AVX High Temperature Products for Surface Mount and SMPS Applications
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Design of High Temperature Combline Band-pass Filters for Downhole Communications
Mohammed Ehteshamuddin; Jebreel M. Salem; Dong Sam Ha
View Articletitled, Design of High Temperature Combline Band-pass Filters for Downhole Communications
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The Design, Simulation, and Performance Characteristics of High Temperature Brushed and Brushless DC Motors, and Their Electronic Controllers
Harold L. Snyder
View Articletitled, The Design, Simulation, and Performance Characteristics of High Temperature Brushed and Brushless DC Motors, and Their Electronic Controllers
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  • ISSN 2380-4491
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