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Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications
Rosemary Bell; Joseph Lachowski; Mitsuru Haga; Inho Lee; Regina Cho; Matthew Thorseth; Jonathan Prange; Mark Scalisi; Yi Qin; Yun-Hyeon Kim; Wataru Tachikawa; Yoon Joo Kim; Mark Lefebvre; Jeff Calvert
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez, A.M. Francis, J. Holmes, T. Vrotsos
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz, Constanze Weber, Olaf Rämer, Malte Spanier, Martin Ihle, Steffen Ziesche, Rainer Kokozinski
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter