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Volume 2018, Issue HiTEC
1 May 2018
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ISSN 2380-4491
Monitoring Magma Under Volcanoes: The Future Of Eruption Forecasting And Geothermal Energy
John Eichelberger
View Articletitled, Monitoring Magma Under Volcanoes: The Future Of Eruption Forecasting And Geothermal Energy
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Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages
Maxim Serebreni; Ross Wilcoxon; F. Patrick McCluskey
View Articletitled, Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages
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Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus Environment
Liangyu Chen; Philip G. Neudeck; Roger D. Meredith; Dorothy Lukco; David J. Spry; Leah M. Nakley; Kyle G. Phillips; Glenn M. Beheim; Gary W. Hunter
View Articletitled, Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus Environment
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Organic Hybrids for Circuit Assemblies – Initial environmental testing of a low cost alternative to ceramic substrate based assemblies
Martin Wickham; Kate Clayton; Ana Robador; Christine Thorogood
View Articletitled, Organic Hybrids for Circuit Assemblies – Initial environmental testing of a low cost alternative to ceramic substrate based assemblies
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Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder
Fumiki Kato; Hiroki Takahashi; Hidekazu Tanisawa; Kenichi Koui; Shinji Sato; Yoshinori Murakami; Hiroshi Nakagawa; Hiroshi Yamaguchi; Hiroshi Sato
View Articletitled, Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder
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Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
Subramani Manoharan; Chandradip Patel; Stevan Hunter; Patrick McCluskey
View Articletitled, Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
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Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic Packages
Charlie Beebout; Erick M. Spory
View Articletitled, Environmentally Hardening IC Die Previously Assembled in Plastic Packages through Die Removal, Bond Pad Replating and Reassembly into Hermetic Packages
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Highly Reliable Pressure-Less Silver Sintering Joints
Sihai Chen; William Shambach; Christine LaBarbera; Ning-Cheng Lee
View Articletitled, Highly Reliable Pressure-Less Silver Sintering Joints
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Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
Maciej Patelka; Nicholas Krasco; Sho Ikeda; Toshiyuki Sato; Miguel Goni; Elbara Ziade; Aaron J. Schmidt
View Articletitled, Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
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Novel solder-mesh interconnection design for power module applications
Adrian Lis; Hiroaki Tatsumi; Tomoki Matsuda; Tomokazu Sano; Yoshihiro Kashiba; Akio Hirose
View Articletitled, Novel solder-mesh interconnection design for power module applications
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Digital Logic Synthesis for 470 Celsius Silicon Carbide Electronics
N. Chiolino; A. M. Francis; J. Holmes; M. Barlow
View Articletitled, Digital Logic Synthesis for 470 Celsius Silicon Carbide Electronics
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Yearlong 500 °C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
Philip G. Neudeck; David J. Spry; Michael J. Krasowski; Norman F. Prokop; Glenn M. Beheim; Liang-Yu Chen; Carl W. Chang
View Articletitled, Yearlong 500 °C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
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Analog and Logic High Temperature Integrated Circuits Based on Enhancement Mode Planar SiC JFETs
Peter Alexandrov; Matt O'Grady; Neil Merrett; Laura Walter
View Articletitled, Analog and Logic High Temperature Integrated Circuits Based on Enhancement Mode Planar SiC JFETs
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Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
M. Montazeri; S. Seal; A. Wallace; A. Mantooth; D. Huitink
View Articletitled, Co-optimized Reliability and Parasitic inductance in Small Footprint Vertical Silicon Carbide MOSFET
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High heat-density SiC heater chip for thermal characterization of high temperature packaging
Naoki Wakasugi; Shijo Nagao; Kim Dongjin; Katsuaki Suganuma
View Articletitled, High heat-density SiC heater chip for thermal characterization of high temperature packaging
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Configurable Digital Logic for Extreme Environments
Richard Rea
View Articletitled, Configurable Digital Logic for Extreme Environments
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Performance Test Results of a Precision Data Acquisition and Control Platform for 200°C+ High Temperature Environments
Jeff Watson; Maithil Pachchigar; Ross Bannatyne; Clay Merritt; Christopher Conrad; Glenn Smollinger; Earle Drack
View Articletitled, Performance Test Results of a Precision Data Acquisition and Control Platform for 200°C+ High Temperature Environments
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Lifetime and Failure Modes of High Temperature SOI Products
Derek Maxwell; Marshall Soares; Matt Coreless
View Articletitled, Lifetime and Failure Modes of High Temperature SOI Products
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From Chips to Modules: Tackling the High Temperature Design Challenge
Pierre Delatte; Zlatan Gradincic
View Articletitled, From Chips to Modules: Tackling the High Temperature Design Challenge
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US Geothermal Funding Outlook (Reducing Cost Barriers for HT SOI Reservoir Monitoring Systems)
Randy A. Normann
View Articletitled, US Geothermal Funding Outlook (Reducing Cost Barriers for HT SOI Reservoir Monitoring Systems)
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A 300°C High Reliability HALT/HAST Screening/Sorting Procedure for Ceramic Capacitors
Harold L. Snyder, Jr.
View Articletitled, A 300°C High Reliability HALT/HAST Screening/Sorting Procedure for Ceramic Capacitors
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Robust Reliability of Ceramic Capacitors for Power Electronics
Abhijit Gurav; John Bultitude; John McConnell; Reggie Phillips
View Articletitled, Robust Reliability of Ceramic Capacitors for Power Electronics
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New Capacitance Sensor Performance
David Andrew
View Articletitled, New Capacitance Sensor Performance
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Mitigation of High Temperature Environments on Electrical Disconnects
Kenneth P. Dowhower
View Articletitled, Mitigation of High Temperature Environments on Electrical Disconnects
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All Issues
  • ISSN 2380-4491
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