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Volume 2021, Issue HiTEC
April 2021
Issue Cover
ISSN 2380-4491
Novel Materials and Structures for Wide and Ultra-Wide Bandgap Semiconductor Switches
A. Christou
View Articletitled, Novel Materials and Structures for Wide and Ultra-Wide Bandgap Semiconductor Switches
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4–20mA optical sensor at 300C using SiC and SOI integrated circuits
Cheng-Po Chen; Emad Andarawis
View Articletitled, 4–20mA optical sensor at 300C using SiC and SOI integrated circuits
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300°C Optical Communications
Emad Andarawis; Cheng-Po (Paul) Chen; Baokai Cheng
View Articletitled, 300°C Optical Communications
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A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
Holger Kappert; Sebastian Braun; Norbert Kordas; Andre Kosfeld; Alexander Utz; Constanze Weber; Olaf Rämer; Malte Spanier; Martin Ihle; Steffen Ziesche; Rainer Kokozinski
View Articletitled, A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
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Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum Capacitors
Alexander Teverovsky
View Articletitled, Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum Capacitors
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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
Daniel Tyler; Svetlana Lukich; Raul DePersia; Chase Guilbeau; Mark Carter
View Articletitled, Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
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GE SiC Semiconductor Device Operation at Extreme Temperatures
David Esler
View Articletitled, GE SiC Semiconductor Device Operation at Extreme Temperatures
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Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part I: Static Parasitic Parameters
Martijn S. Duraij; Yudi Xiao; Gabriel Zsurzsan; Zhe Zang
View Articletitled, Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part I: Static Parasitic Parameters
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Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part II: Dynamic Parasitic Parameters
Martijn S. Duraij; Yudi Xiao; Gabriel Zsurzsan; Zhe Zang
View Articletitled, Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part II: Dynamic Parasitic Parameters
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Package Design and Analysis for Vertical Gallium Nitride Field Effect Transistors
John Harris; David Huitink; Dan Ewing
View Articletitled, Package Design and Analysis for Vertical Gallium Nitride Field Effect Transistors
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Upscaling of 500 °C Durable SiC JFET-R Integrated Circuits
Philip G. Neudeck; David J. Spry; Michael J. Krasowski; Liangyu Chen; Lawrence C. Greer; Carl W. Chang; Dorothy Lukco; Glenn M. Beheim; Norman F. Prokop
View Articletitled, Upscaling of 500 °C Durable SiC JFET-R Integrated Circuits
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A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits
Liangyu Chen; Philip G. Neudeck; David J. Spry; Glenn M. Beheim; Gary W. Hunter
View Articletitled, A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits
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Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits
Alain Izadnegahdar; Stephanie L. Booth; David J. Spry; Philip G. Neudeck
View Articletitled, Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits
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470 Celsius Packaging System for Silicon Carbide Electronics
N. Chiolino; A. M. Francis; J. Holmes; M. Barlow; C. Perkowski
View Articletitled, 470 Celsius Packaging System for Silicon Carbide Electronics
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Simulating the Effect of Rigid Frameworks on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys
Gilad Nave; Patrick McCluskey
View Articletitled, Simulating the Effect of Rigid Frameworks on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys
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A 300°C High Reliability HALT/HAST Screening/Sorting Procedure for Ceramic Capacitors – Part 2
Harold L. Snyder, Jr.
View Articletitled, A 300°C High Reliability HALT/HAST Screening/Sorting Procedure for Ceramic Capacitors – Part 2
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Designs for reliability and failure mode prevention of electrical feedthroughs in integrated downhole logging tools
Hua Xia; Nelson Settles; Michael Grimm; Gaery Rutherford; David DeWire
View Articletitled, Designs for reliability and failure mode prevention of electrical feedthroughs in integrated downhole logging tools
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Low Loss LTCC Ag System for 5G Applications
Ellen Tormey; Chao Ma; John Maloney; Bradford Smith; Sid Sridharan; Yi Yang
View Articletitled, Low Loss LTCC Ag System for 5G Applications
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Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig; Sebastian Holtkämper; Lars Helmich; Michael Brökelmann
View Articletitled, Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
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Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
S. Perez; A.M. Francis; J. Holmes; T. Vrotsos
View Articletitled, Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
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All Issues
  • ISSN 2380-4491
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