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In addition to the annual Symposium, IMAPS also organizes many workshops and conferences on an annual basis. Events range in topic, attendance, and content. The Technical Committee of the Society reviews and creates events on the emerging technologies that are impacting our industry as well as the established packaging issues that have been adopted by the entire microelectronics/packaging supply chain. This section of IMAPSource now includes the proceedings papers from our Ceramic Interconnect (CICMT), and High Temperature Conferences (HiTEC & HiTEN), as well as the presentation slides from our spring Device Packaging Conference.

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