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Journal Articles

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz ...

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000018–000024.

https://doi.org/10.4071/2380-4491.2021.HiTEC.000018

Published: 22 June 2021

View articletitled, A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Journal Articles

Development and Evaluation of Equipment Enhancements for Transient Liquid Phase Bonding (TLPB) and Sintering

Ventzeslav Rangelov, Silvia Altenbockum, Jessica Kleff, Constanze Weber, Hermann Oppermann ...

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (IMAPS): 1–5.

https://doi.org/10.4071/2380-4491.2017.IMAPS.1

Published: 01 January 2017

View articletitled, Development and Evaluation of Equipment Enhancements for Transient Liquid Phase Bonding (TLPB) and Sintering

Journal Articles

HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature

Holger Vogt, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich ...

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000001–000010.

https://doi.org/10.4071/2016-HITEC-1a

Published: 01 January 2016

View articletitled, HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature