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Holger Kappert
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Journal Articles

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Open Access
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000018–000024.
https://doi.org/10.4071/2380-4491.2021.HiTEC.000018
Published: 22 June 2021
View articletitled, A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
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Journal Articles

On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology

Open Access
Steffen Ziesche, Adrian Goldberg, Uwe Partsch, Holger Kappert, Heidrun Kind ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (HiTen): 000107–000111.
https://doi.org/10.4071/2380-4491.2019.HiTen.000107
Published: 01 July 2019
View articletitled, On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology
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Journal Articles

Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °C

Open Access
Sebastian Braun, Norbert Kordas, Alexander Utz, Holger Kappert, Rainer Kokozinski
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (HiTen): 000112–000116.
https://doi.org/10.4071/2380-4491.2019.HiTen.000112
Published: 01 July 2019
View articletitled, Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250 °C
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Journal Articles

High Temperature EEPROM Using a Differential Approach for High Reliability

Open Access
Holger Kappert, Sebastian Braun, Michael Alfring, Norbert Kordas, Andreas Kelberer ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (HiTEN): 000042–0000045.
https://doi.org/10.4071/2380-4491.2017.HiTEN.42
Published: 01 July 2017
View articletitled, High Temperature EEPROM Using a Differential Approach for High Reliability
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Journal Articles

HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature

Open Access
Holger Vogt, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000001–000010.
https://doi.org/10.4071/2016-HITEC-1a
Published: 01 January 2016
View articletitled, HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
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Journal Articles

High Temperature GaN Gate Driver in SOI CMOS Technology

Open Access
Holger Kappert, Sebastian Braun, Norbert Kordas, Stefan Dreiner, Rainer Kokozinski
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000112–000115.
https://doi.org/10.4071/2016-HITEC-112
Published: 01 January 2016
View articletitled, High Temperature GaN Gate Driver in SOI CMOS Technology
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Journal Articles

High-Temperature Trench Capacitors, Using Thin-Film ALD Dielectrics

Open Access
Dorothee Dietz, Yusuf Celik, Andreas Goehlich, Holger Vogt, Holger Kappert
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (HiTEN): 000130–000133.
https://doi.org/10.4071/HiTEN-Session4-Paper4_2
Published: 01 January 2015
View articletitled, High-Temperature Trench Capacitors, Using Thin-Film ALD Dielectrics
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Journal Articles

High Temperature 0.35 Micron Silicon-on-Insulator CMOS Technology

Open Access
Holger Kappert, Stefan Dreiner, Dirk Dittrich, Katharina Grella, Andreas Kelberer ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (HITEC): 000154–000158.
https://doi.org/10.4071/HITEC-WA14
Published: 01 January 2014
View articletitled, High Temperature 0.35 Micron Silicon-on-Insulator CMOS Technology
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Journal Articles

Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing

Open Access
Alexander Schmidt, Holger Kappert, Rainer Kokozinski
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2013) 2013 (HITEN): 000122–000133.
https://doi.org/10.4071/HITEN-TA14
Published: 01 January 2013
View articletitled, Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing
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Journal Articles

A Cyclic RSD Analog-Digital-Converter for Application Specific High Temperature Integrated Circuits up to 250°C

Open Access
Alexander Schmidt, Holger Kappert, Wolfgang Heiermann, Rainer Kokozinski
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (HITEC): 000214–000219.
https://doi.org/10.4071/HITEC-2012-WP13
Published: 01 January 2012
View articletitled, A Cyclic RSD Analog-Digital-Converter for Application Specific High Temperature Integrated Circuits up to 250°C
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Journal Articles

A Robust SOI Gain-Boosted Operational Amplifier Targeting High Temperature Precision Applications up to 300°C

Open Access
Alexander Schmidt, Abdel Moneim Marzouk, Holger Kappert, Rainer Kokozinski
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (HITEN): 000238–000242.
https://doi.org/10.4071/HITEN-Paper6-ASchmidt
Published: 01 January 2011
View articletitled, A Robust SOI Gain-Boosted Operational Amplifier Targeting High Temperature Precision Applications up to 300°C
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