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1-11 of 11
Holger Kappert
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Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000018–000024.
Published: 22 June 2021
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (HiTen): 000107–000111.
Published: 01 July 2019
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (HiTen): 000112–000116.
Published: 01 July 2019
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (HiTEN): 000042–0000045.
Published: 01 July 2017
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000001–000010.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000112–000115.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (HiTEN): 000130–000133.
Published: 01 January 2015
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (HITEC): 000154–000158.
Published: 01 January 2014
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2013) 2013 (HITEN): 000122–000133.
Published: 01 January 2013
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (HITEC): 000214–000219.
Published: 01 January 2012
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (HITEN): 000238–000242.
Published: 01 January 2011