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Martin Ihle
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Journal Articles

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Open Access
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000018–000024.
https://doi.org/10.4071/2380-4491.2021.HiTEC.000018
Published: 22 June 2021
View articletitled, A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
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Journal Articles

HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature

Open Access
Holger Vogt, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000001–000010.
https://doi.org/10.4071/2016-HITEC-1a
Published: 01 January 2016
View articletitled, HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
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Journal Articles

High current conductors in LTCC

Open Access
Steffen Ziesche, Martin Ihle
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (CICMT): 000025–000029.
https://doi.org/10.4071/CICMT-2012-TA14
Published: 01 September 2012
View articletitled, High current conductors in LTCC
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Journal Articles

Novel High-g Accelerometer Geometry Requiring 90 Degree Contacting Techniques

Open Access
Robert Kuells, Siegfried Nau, Manfred Salk, Klaus Thoma, Martin Ihle ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (CICMT): 000520–000527.
https://doi.org/10.4071/CICMT-2012-WP32
Published: 01 September 2012
View articletitled, Novel High-g Accelerometer Geometry Requiring 90 Degree Contacting Techniques
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Journal Articles

Aerosol Printing of High Resolution Films for LTCC-Multilayer Components

Open Access
Martin Ihle, Uwe Partsch, Sindy Mosch, Adrian Goldberg
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (CICMT): 000071–000076.
https://doi.org/10.4071/CICMT-2012-TA25
Published: 01 September 2012
View articletitled, Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
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Journal Articles

Novel Technology Options for Multilayer-Based Ceramic Microsystems

Open Access
Uwe Partsch, Adrian Goldberg, Martin Ihle, Gunter Hagen, D. Arndt
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (CICMT): 000166–000171.
https://doi.org/10.4071/CICMT-2011-WA13
Published: 01 September 2011
View articletitled, Novel Technology Options for Multilayer-Based Ceramic Microsystems
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