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Patrick McCluskey
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Journal Articles

Simulating the Effect of Rigid Frameworks on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys

Gilad Nave, Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000089–000093.
https://doi.org/10.4071/2380-4491.2021.HiTEC.000089
Published: 22 June 2021
View article titled, Simulating the Effect of Rigid Frameworks on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys
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Journal Articles

Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages

Maxim Serebreni, Ross Wilcoxon, F. Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000007–000014.
https://doi.org/10.4071/2380-4491-2018-HiTEN-000007
Published: 01 May 2018
View article titled, Modelling the Influence of Conformal Coatings on Thermo-Mechanical Fatigue of Solder Interconnects in Electronic Packages
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Journal Articles

Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition

Subramani Manoharan, Chandradip Patel, Stevan Hunter, Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000032–000038.
https://doi.org/10.4071/2380-4491-2018-HiTEN-000032
Published: 01 May 2018
View article titled, Influence of Initial Shear Strength on Time-to-Failure of Copper (Cu) Wire Bonds in Thermal Aging Condition
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Journal Articles

Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds

Subramani Manoharan, Chandradip Patel, Stevan Hunter, Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (HiTEN): 000068–000073.
https://doi.org/10.4071/2380-4491.2017.HiTEN.68
Published: 01 July 2017
View article titled, Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds
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Journal Articles

Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000092–000096.
https://doi.org/10.4071/2016-HITEC-92
Published: 01 January 2016
View article titled, Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire Bonds
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Journal Articles

Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints

S. Ali Moeini, Hannes Greve, F. Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (HITEC): 000355–000363.
https://doi.org/10.4071/HITEC-THA25
Published: 01 January 2014
View article titled, Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints
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Journal Articles

LT-TLPS Die Attach for High Temperature Electronic Packaging

Hannes Greve, F. Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2013) 2013 (HITEN): 000246–000253.
https://doi.org/10.4071/HITEN-WA16
Published: 01 January 2013
View article titled, LT-TLPS Die Attach for High Temperature Electronic Packaging
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Journal Articles

Performance of MEMS Vibratory Gyroscope under Harsh Environments

Chandradip Patel, Patrick McCluskey
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (DPC): 000633–000654.
https://doi.org/10.4071/2012DPC-ta34
Published: 01 January 2012
View article titled, Performance of MEMS Vibratory Gyroscope under Harsh Environments
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Journal Articles

Temperature and Humidity Effects on MEMS Vibratory Gyroscope

Chandradip Patel, F. Patrick McCluskey, David Lemus
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (DPC): 001361–001390.
https://doi.org/10.4071/2011DPC-wa22
Published: 01 January 2011
View article titled, Temperature and Humidity Effects on MEMS Vibratory Gyroscope
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Journal Articles

Performance and Reliability of MEMS Gyroscopes and Packaging at High Temperatures

Patrick McCluskey, Chandradip Patel, David Lemus
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2010) 2010 (HITEC): 000359–000366.
https://doi.org/10.4071/HITEC-PMcCluskey-THA22
Published: 01 January 2010
View article titled, Performance and Reliability of MEMS Gyroscopes and Packaging at High Temperatures
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