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Robert N. Dean
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Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (DPC): 001323–001342.
Published: 01 January 2019
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (DPC): 001050–001063.
Published: 01 January 2019
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–27.
Published: 01 January 2017
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–31.
Published: 01 January 2017
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 001554–001587.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 000853–000880.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 001613–001631.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 001632–001662.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 001498–001542.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (DPC): 001016–001047.
Published: 01 January 2015
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (DPC): 001564–001593.
Published: 01 January 2015
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (DPC): 001048–001069.
Published: 01 January 2015
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (DPC): 001594–001625.
Published: 01 January 2015
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (DPC): 001671–001700.
Published: 01 January 2015
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (DPC): 001046–001071.
Published: 01 January 2014
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (DPC): 001380–001406.
Published: 01 January 2014
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (DPC): 000984–001011.
Published: 01 January 2014
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (DPC): 000588–000608.
Published: 01 January 2014
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (DPC): 000586–000614.
Published: 01 January 2012
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (DPC): 001650–001673.
Published: 01 January 2011
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