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1-8 of 8
Seung Wook Yoon
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Journal Articles
Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
Open Access
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–20.
Published: 01 January 2017
Journal Articles
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
Open Access
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 000809–000825.
Published: 01 January 2016
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (DPC): 000815–000829.
Published: 01 January 2014
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2013) 2013 (DPC): 001438–001457.
Published: 01 January 2013
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (DPC): 001507–001526.
Published: 01 January 2012
Journal Articles
300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with Performance
Open Access
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (DPC): 001046–001070.
Published: 01 January 2011
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2010) 2010 (DPC): 1–20.
Published: 01 January 2010
Journal Articles
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2010) 2010 (DPC): 1–18.
Published: 01 January 2010