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Seung Wook Yoon
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Journal Articles

Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology

Seung Wook Yoon
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (DPC): 1–20.
https://doi.org/10.4071/2017DPC-TP2_Presentation5
Published: 01 January 2017
View article titled, Advanced 3D eWLB-SiP (embedded Wafer Level Ball Grid Array – System in Package) Technology
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Journal Articles

Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

Bernard Adams, Won Kyung Choi, Duk Ju Na, Andy Yong, Seung Wook Yoon ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (DPC): 000809–000825.
https://doi.org/10.4071/2016DPC-TP24
Published: 01 January 2016
View article titled, Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
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Journal Articles

A Flexible Manufacturing Method for Wafer Level Packages

Tom Strothmann, Damien Pricolo, Seung Wook Yoon, Yaojian Lin
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2014) 2014 (DPC): 000815–000829.
https://doi.org/10.4071/2014DPC-tp21
Published: 01 January 2014
View article titled, A Flexible Manufacturing Method for Wafer Level Packages
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Journal Articles

Robust Reliability Performance of Large size eWLB (Fan-out WLP)

Seung Wook Yoon
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2013) 2013 (DPC): 001438–001457.
https://doi.org/10.4071/2013DPC-wp21
Published: 01 January 2013
View article titled, Robust Reliability Performance of Large size eWLB (Fan-out WLP)
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Journal Articles

Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution

Seung Wook Yoon, Yaojian Lin, Yonggang Jin, Jerome Teysseyre, Xavier Baraton ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (DPC): 001507–001526.
https://doi.org/10.4071/2012DPC-wa22
Published: 01 January 2012
View article titled, Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution
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Journal Articles

300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with Performance

Seung Wook Yoon, Yaojian Lin, Pandi C. Marimuthu, Yeong J. Lee
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (DPC): 001046–001070.
https://doi.org/10.4071/2011DPC-tp33
Published: 01 January 2011
View article titled, 300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with Performance
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Journal Articles

Advanced SiP Packaging Technologies of IPD for Mobile Applications

Geun Sik Kim, Kai Liu, Flynn Carson, Seung Wook Yoon, Meenakshi Padmanathan
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2010) 2010 (DPC): 1–20.
https://doi.org/10.4071/2010DPC-wp31
Published: 01 January 2010
View article titled, Advanced SiP Packaging Technologies of IPD for Mobile Applications
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Journal Articles

3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections

Seung Wook Yoon, Dzafir Shariff, Jae Hun Ku, Pandi Chelvam Marimuthu, Flynn Carson
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2010) 2010 (DPC): 1–18.
https://doi.org/10.4071/2010DPC-wa11
Published: 01 January 2010
View article titled, 3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections
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