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Shinji Sato
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Journal Articles

Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder

Fumiki Kato, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2018) 2018 (HiTEC): 000028–000031.
https://doi.org/10.4071/2380-4491-2018-HiTEN-000028
Published: 01 May 2018
View article titled, Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder
Open the PDF for Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder in another window
Journal Articles

Potential of Zn-Al Solder Alloy for High Temperature SiC Power Module

Hidekazu Tanisawa, Fumiki Kato, Hiroki Takahashi, Kenichi Koui, Shinji Sato ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (HiTEN): 000197–000200.
https://doi.org/10.4071/2380-4491.2017.HiTEN.197
Published: 01 July 2017
View article titled, Potential of Zn-Al Solder Alloy for High Temperature SiC Power Module
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Journal Articles

Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test

Fumiki Kato, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2017) 2017 (HiTEN): 1–5.
https://doi.org/10.4071/2380-4491.2017.HiTEN.223
Published: 01 July 2017
View article titled, Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test
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Journal Articles

Eutectic Zn-Al Die Attachment for Higher T j SiC Power Applications: Fabrication Method and Die Shear Strength Reliability

Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (HITEC): 000110–000116.
https://doi.org/10.4071/HITEC-2012-TP22
Published: 01 January 2012
View article titled, Eutectic Zn-Al Die Attachment for Higher T j SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Open the PDF for Eutectic Zn-Al Die Attachment for Higher T j SiC Power Applications: Fabrication Method and Die Shear Strength Reliability in another window