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Steffen Ziesche
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Journal Articles

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C

Open Access
Holger Kappert, Sebastian Braun, Norbert Kordas, Andre Kosfeld, Alexander Utz ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2021) 2021 (HiTEC): 000018–000024.
https://doi.org/10.4071/2380-4491.2021.HiTEC.000018
Published: 22 June 2021
View articletitled, A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
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Journal Articles

On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology

Open Access
Steffen Ziesche, Adrian Goldberg, Uwe Partsch, Holger Kappert, Heidrun Kind ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2019) 2019 (HiTen): 000107–000111.
https://doi.org/10.4071/2380-4491.2019.HiTen.000107
Published: 01 July 2019
View articletitled, On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology
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Journal Articles

HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature

Open Access
Holger Vogt, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich ...
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2016) 2016 (HiTEC): 000001–000010.
https://doi.org/10.4071/2016-HITEC-1a
Published: 01 January 2016
View articletitled, HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
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Journal Articles

Investigation of inhomogeneous shrinkage of partially crystallizing Low Temperature Co-fired Ceramics (LTCC)”

Open Access
Christian Lenz, Sandro Kappert, Steffen Ziesche, Uwe Partsch, Holger Neubert
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2015) 2015 (CICMT): 000185–000191.
https://doi.org/10.4071/CICMT-WA25
Published: 01 September 2015
View articletitled, Investigation of inhomogeneous shrinkage of partially crystallizing Low Temperature Co-fired Ceramics (LTCC)”
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Journal Articles

High current conductors in LTCC

Open Access
Steffen Ziesche, Martin Ihle
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (CICMT): 000025–000029.
https://doi.org/10.4071/CICMT-2012-TA14
Published: 01 September 2012
View articletitled, High current conductors in LTCC
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Journal Articles

Combined 3D Micro Structuring of Ceramic Green Tape Using Punching, Embossing and Laser Processing

Open Access
Gunter Hagen, Thomas Kopp, Steffen Ziesche, Uwe Partsch, Ester Ruprecht
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2012) 2012 (CICMT): 000341–000347.
https://doi.org/10.4071/CICMT-2012-WA34
Published: 01 September 2012
View articletitled, Combined 3D Micro Structuring of Ceramic Green Tape Using Punching, Embossing and Laser Processing
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Journal Articles

Ceramic Interface and Multilayer Technology for Micro Fuel Cells

Open Access
Steffen Ziesche, Uwe Partsch A. Michaelis
Journal: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) (2011) 2011 (CICMT): 000029–000032.
https://doi.org/10.4071/CICMT-2011-TA13
Published: 01 September 2011
View articletitled, Ceramic Interface and Multilayer Technology for Micro Fuel Cells
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