Cu core columns, a cylindrical-shaped copper core material with Ni and solder plating, are attracting attentions as next generation joint material instead of normal solder balls, Cu core balls, and even Cu plating pillars. Cu core columns have the ability to control and maintain a consistent stand-off height, and can achieve remarkable electric and thermal conductivity because of excellent physical properties of Cu. However, it is unclear whether it can be mounted stably like normal solder balls because of its cylindrical shape. Therefore, in this paper, we set our goal to establish Cu Core Column application for next generation bumping material by examining the melting behavior, wettability of Cu core column bumps, and reliability for drop impact and thermal stress.

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