Abstract

Protecting miniature implantable electronics may require mm scale hermetic packages. Glass-ceramic bonding by selective laser sintering of glass sealing paste using a defocused Nd:YAG laser is presented. Glass sealing paste (FX11-036, Ferro) is screen printed onto alumina ceramic, clamped in contact with borosilicate glass, and laser treated while heating to 250°C. With the addition of defocusing and a heat source the glass paste reflowed and wetted both the alumina and coverslip surfaces, with an optimal effect between 10 mm and 15 mm defocusing. This method is promising to create electrically non-conductive hermetic seals at the mm scale.

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