Anisotropic Conductive Technologies (ACT), and materials comprising films and epoxies, started as a solution to provide low-cost reliable interconnection for glass displays on small, cheap calculators. ACT is mature now and have encroached into other types of technologies, especially Flip Chip, LEDs, OELDS, MEMS, 3D packaging, Microwave/RF and Optics. In today's assembly lines, ACT have replaced gold bumps, solder balls, wire bonds, and created new, more cost efficient chip-on chip, chip-on-film, chip-on-board, and chip-on-ceramic applications. Companies around the globe have realized the advantages of this technology to control thermal management, failures, speed of production, and they have vigorously engaged in protection of their intellectual property. The author will present a survey of the technology from a patent, trade secret, and licensing approach. In his analyses of the findings, he will show how different companies around the globe are using ACT to solve their interconnection needs. The author will also present future types of ACT and its uses for military, aerospace, and other commercial applications.

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