It has been used various pad finish materials to enhance the reliability of solder joint and Electroless Ni Immersion Gold (the following : ENIG) pad has been used more than others.

This study is about reliability according to being used in commercial Electrolytic Ni pad and ENIG pad, and was observed behavior of various Cu contents.

After reflow, the inter-metallic compound (IMC) between solder and pad is composed of Cu6Sn5 (Ni substituted) by using EDS, and in case of ENIG, between IMC and Ni layer was observed the dark layer (Ni3P layer).

Additional, it could be controlled the thickness of dark layer according to Cu contents.

Investigated the different fracture mode between electrolytic Ni and ENIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between 1st IMC and 2nd IMC, and in case of ENIG pad, accelerated stress propagated along the weaken surface such as dark layer.

The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

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