Material deposition utilizing a dispensing approach has been widely used in microelectronics for decades. The trend towards more compact and complicated electronic devices at a lower cost has challenged traditional manufacturing and packaging processes, including dispensing. Dispensed coatings for applications such as EMI/RFI shielding, encapsulating, heat transfer, enhanced structural support, and shock protection bring additional benefits. Unfortunately there are challenges due to the component's increased density, the interconnects in a limited foot print, and the three dimensional nature of the components. Technologies and tools are greatly needed to provide not only accuracy, repeatability, and flexibility, but also a wide range of material choices, dimensionality and the ability for in-line integration. The high speed micro-dispensing/direct printing technology of nScrypt provides such a solution with pico-liter level volume control, advanced computerized motion platform, high resolution vision system and the ability of printing on 3D conformal surfaces. The materials that can be processed include but not limited to: conductive, dielectric, adhesive, epoxy, rubberized polymer and encapsulate.

This content is only available as a PDF.