3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP example, showing a 25% power advantage when implemented in 3D compared with 2D. Finally critical areas that need better solutions are explored. These include cost management, design planning, test management, and thermal management.

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