The embedded EE systems complexity is still growing. During this decade, it is even going to accelerate with the deployment of Hybrids and Electrical Vehicles. To control the physical EE architecture complexity and ECU cost, car manufacturers must extend the functional perimeter of ECU and decrease the ECU number. This paper illustrates the needs and constraints on EE systems, notably linked to the Hybrids and Electric Vehicle. It is likely to foresee technological breakthrough in term of assembly and packaging for embedded EE systems over a 5 to 10 years period.
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© 2010 International Microelectronics Assembly and Packaging Society
2010