Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC's functionality and performance can be enhanced with the incorporation of passive devices such as resistors, capacitors, and inductors into the structure of the substrate. This incorporation, which eliminates surface mount solder joints is desirable for improving system reliability and allows for increased package density. Commercially available dielectrics for embedding capacitors into LTCC are limited and the incorporation of such systems into LTCC substrates poses processing challenges related to material compatibility. This paper will review multiple dielectric systems and techniques for embedding capacitors into LTCC as well as present new data related to the cofiring behavior of LTCC and custom dielectrics.

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*Operated for the United States Department of Energy under Contract No. DE-ACO4-01AL66850

**Operated for the United States Department of Energy under Contract No. DE-ACO4-94AL85000