The “Black Pad” phenomenon referring to blackening of electrolessly plated nickel-phosphorous (Ni(P)) films after the immersion gold (IG) process was reproduced using pure chemicals for the first time. Chemical composition of the electrolyte most suitable for the black pad reproduction was proposed, and it was found that submicron scale nodular variation of the P content of the Ni(P) film induced potential differences large enough to drive galvanic corrosion when exposed to the electrolyte; gold cyanide solution in this case. Instead of conventional potential measurement techniques, corrosion couple experiments using Ni(P) films with different P content were performed to substantiate preferential corrosion, which occurred at the lower P side with the propensity of forming black pad getting more severe with the P content difference (ΔP) between films. Subsequent AFM analysis showed that variations of nodular shapes and curvatures among nodules led to submicron scale variations of the P content in the film, which could promote galvanic corrosion.
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Research Article|
January 01 2010
A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold process Open Access
J. H. Kim;
J. H. Kim
a Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, KOREA
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K. H. Kim;
K. H. Kim
b Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, U.S.A.
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Jin Yu
a Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, KOREA
Phone : +82-42-350-4274, Fax : +82-42-350-8840, e-mail : [email protected]
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International Symposium on Microelectronics (2010) 2010 (1): 000306–000313.
Citation
J. H. Kim, K. H. Kim, Jin Yu; A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold process. International Symposium on Microelectronics 1 January 2010; 2010 (1): 000306–000313. doi: https://doi.org/10.4071/isom-2010-TP4-Paper4
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