Use of very thin wafers in the semiconductor industry poses handling challenges during manufacturing. The goal of this study was to determine whether applying thin coatings could create stronger, easy to handle wafers. Standard three-point bend testing of coated and uncoated thin wafer samples was used to determine whether the coating strengthened the wafers to improve their handling properties. Data indicated that only the thinnest coating on the thinner silicon increased the peak break strength in three-point bend testing.

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