This study reiterates the fact that revolutionary heat sink geometries, materials and overall exponentially higher performing alternatives are continuously and highly needed as applied to the air cooling of a typical computer system microprocessor. Attention was focused on forced convection regimes of operation and from a system level approach. Minor improvements in the performance of air cooled microprocessor heat sinks via typical small design improvements are discussed. Laminar convection and constant heat dissipation were looked at. The CFD simulations exemplified were completed for several power levels and ambient air characterized by a Pr = 0.71. The numerical results presented coincided in large with the experimentally derived documented data. In conclusion, the authors stress the fact that leading-edge alternatives in air-cooled heat removal of such applications are imperiously necessary.

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