Packaging in IBIS-AMI Technology

As serial links become faster and more complex, it is ever more challenging to model the silicon in an accurate and efficient manner. Traditional IBIS package models are simply not accurate enough and lack the bandwidth required for high-speed serial channels. The IBIS Algorithmic Modeling Interface (AMI) is a promising standard that is able to accurately model drivers and receivers that include equalizers and clock data recovery circuits. The introduction of the AMI modeling standard presents the opportunity to combine accurate driver and receiver models with high quality scattering parameter and W-element models of the passive IC, package, and PCB structures. In this paper we explore simulation with AMI models driving accurate high-bandwidth channel models of packages and printed circuit boards for robust simulation of high-speed serial systems. We also use these simulations to investigate the effects of variability in the manufactured channel.