Substrates play a critical role in the quality and reliability of electronic packages and systems. Metal core substrates provide opportunities with respect to strength, heat dissipation, and speed over common organic substrates. The metal core provides an opportunity for grounding enhancements in RF circuits.
This paper presents the results of the development of a metal core substrate design which has advantages over conventional competitive designs. The manufacturing flow developed in this work has fewer process steps, uses fewer materials and shows interfacial adhesion strength above industry requirements.
The work outlines material evaluations to enhance the interfacial adhesion and corrosion resistance. The results of the evaluation of mechanical, chemical, and other methods to enhance interfacial adhesion are presented and compared. The enhanced interface shows significant adhesion increase for the circuitry metal over and beyond industry requirement.
