Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire Bonding

Oezkoek, Mustafa; Roberts, Hugh; McGurran, Joe

doi:10.4071/isom-2010-WP4-Paper5

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Research Article| January 01 2010

Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire Bonding

Mustafa Oezkoek;

Mustafa Oezkoek

Atotech Deutschland GmbH, Erassmusstrasse 20, 10553 Berlin/Germany

Phone: +49 (0) 30 - 349 85 845 E-mail: [email protected]

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Hugh Roberts;

Hugh Roberts

Atotech USA Inc., Rock Hill, SC, 1750 Overview Drive Rock Hill, SC 29730 USA

Phone: +1 803 817 3500 E-mail: [email protected]

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Joe McGurran

Atotech USA Inc., Rock Hill, SC, 1750 Overview Drive Rock Hill, SC 29730 USA

Phone: +1 803 817 3500 E-mail: [email protected]

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International Symposium on Microelectronics (2010) 2010 (1): 000675–000681.

https://doi.org/10.4071/isom-2010-WP4-Paper5

As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2]

This paper shows the benefits of using a pure palladium layer in ENEPIG and ENEP (Electroless Nickel / Electroless Palladium) surface finishes in terms of physical properties and in terms of gold wire bonding and solder joint integrity.

ENEPIG, ENEP, wire bonding, gold wire bonding, copper wire bonding, solder joint integrity

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2010

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