Fine round and oblong features were printed using fine solder paste. Diameters and spacings were measured and data was analyzed to show solder feature printing capabilities. The printed features varied from 50 to 450 micron diameters with 50 to 150 micron spacings. Analysis of the solder features showed that printing of round features was possible at every size and spacing, with minimal bridging of the very small spaced features after reflow.

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