Invited Session on HETEROGENEOUS INTEGRATION ROADMAP - SiP and Module. Outline: ** SiP Packaging Toolbox - Interconnect; Architecture; Footprint; Functional blocks; and ** Challenges and Solutions - Material, assembly, cost, standardization.

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Author notes

Rolf Aschenbrenner is deputy director at Fraunhofer IZM and head of department System Integration and Interconnection Technologies. He is IEEE Fellow and has had long-term activities for IEEE.

Dr. Klaus Pressel joined Infinenon in 2001, where he now focuses on innovations in assembly and packaging technology.

Dr. Andreas Grassmann is Senior Director for package innovation at Infinenon